M.O. Alam
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Mechanical Engineering top 2%
- Advanced Welding Techniques Analysis
- Intermetallics and Advanced Alloy Properties
- Aluminum Alloys Composites Properties
Papers in
-
- Electronic Packaging and Soldering Technologies 48
- 3D IC and TSV technologies 31
- Integrated Circuits and Semiconductor Failure Analysis 5
-
- Advanced Welding Techniques Analysis 14
- Intermetallics and Advanced Alloy Properties 12
- Metal Forming Simulation Techniques 3
- Co-authors
- Y.C. Chan (24 shared papers)Y.C. Chan (11 shared papers)Bin Wu (15 shared papers)K. N. Tu (4 shared papers)Y. C. Chan (8 shared papers)K.C. Hung (4 shared papers)C. Bailey (14 shared papers)W. Jillek (2 shared papers)
- Journals
- Microelectronics Reliability (9 papers)Journal of Electronic Materials (6 papers)Chemistry of Materials (3 papers)Journal of Applied Physics (3 papers)Journal of materials research/Pratt's guide to venture capital sources (3 papers)
- Partner nations
- Hong KongUnited KingdomUnited States
In The Last Decade
M.O. Alam
53 papers receiving 1.5k citations
Peers
Comparison fields: 5 of 53
- Electrical and Electronic Engineering 1.4k
- Mechanical Engineering 801
- General Materials Science 56
- Mechanics of Materials 176
- Electronic, Optical and Magnetic Materials 120
Countries citing papers authored by M.O. Alam
This map shows the geographic impact of M.O. Alam's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M.O. Alam with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M.O. Alam more than expected).
Fields of papers citing papers by M.O. Alam
This network shows the impact of papers produced by M.O. Alam. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M.O. Alam. The network helps show where M.O. Alam may publish in the future.
Co-authors
The 25 scholars most cited alongside M.O. Alam, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 53 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2011 | 129 | |
| 2 | 2005 | 110 | |
| 3 | 2002 | 106 | |
| 4 | 2003 | 96 | |
| 5 | 2003 | 82 | |
| 6 | 2003 | 74 | |
| 7 | 2005 | 65 | |
| 8 | 2003 | 62 | |
| 9 | 2012 | 56 | |
| 10 | 2004 | 53 | |
| 11 | 2003 | 51 | |
| 12 | 2003 | 50 | |
| 13 | 2005 | 48 | |
| 14 | 2006 | 48 | |
| 15 | 2005 | 45 | |
| 16 | 2002 | 44 | |
| 17 | 2006 | 44 | |
| 18 | 2003 | 37 | |
| 19 | 2003 | 34 | |
| 20 | 2005 | 30 |
About M.O. Alam
M.O. Alam is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Materials Chemistry and General Materials Science, having authored 53 papers that have together received 1.6k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (48 papers), 3D IC and TSV technologies (31 papers), Advanced Welding Techniques Analysis (14 papers), Intermetallics and Advanced Alloy Properties (12 papers), Integrated Circuits and Semiconductor Failure Analysis (5 papers), Adhesion, Friction, and Surface Interactions (4 papers), Thermal properties of materials (4 papers) and Metal Forming Simulation Techniques (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.4k citations), Mechanical Engineering (801 citations), General Materials Science (56 citations), Mechanics of Materials (176 citations) and Electronic, Optical and Magnetic Materials (120 citations). M.O. Alam has collaborated with scholars based in Hong Kong, United Kingdom and United States. Frequent co-authors include Y.C. Chan, Y.C. Chan, Bin Wu, K. N. Tu, K. N. Tu, Y. C. Chan, K.C. Hung, C. Bailey, W. Jillek and Hau Ping Chan. Their work appears in journals such as Microelectronics Reliability, Journal of Electronic Materials, Chemistry of Materials, Journal of Applied Physics and Journal of materials research/Pratt's guide to venture capital sources.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.