C. Law
Impact in
- General Materials Science top 0.5%
- Metallurgical and Alloy Processes
- Mechanical Engineering top 2%
- Intermetallics and Advanced Alloy Properties
- Advanced Welding Techniques Analysis
- Aluminum Alloys Composites Properties
Papers in
-
- Electronic Packaging and Soldering Technologies 12
- 3D IC and TSV technologies 5
-
- Intermetallics and Advanced Alloy Properties 6
- Aluminum Alloys Composites Properties 3
- Advanced Welding Techniques Analysis 3
- Co-authors
- Chi‐Man Lawrence Wu (11 shared papers)Daquan Yu (9 shared papers)Lu Wang (7 shared papers)J.K.L. Lai (2 shared papers)K.T. Chau (2 shared papers)R.H.C. Wong (2 shared papers)Weishen Zhu (1 shared paper)T.M. Yue (1 shared paper)
- Journals
- Journal of Electronic Materials (5 papers)Journal of Alloys and Compounds (2 papers)International Journal of Rock Mechanics and Mining Sciences (2 papers)Materials Science and Engineering R Reports (1 paper)IEEE Transactions on Advanced Packaging (1 paper)
- Partner nations
- Hong KongChinaUnited States
In The Last Decade
C. Law
20 papers receiving 1.3k citations
C. Law's Hit Papers
Peers
Comparison fields: 5 of 57
- General Materials Science 102
- Mechanical Engineering 930
- Electrical and Electronic Engineering 1.1k
- Aerospace Engineering 218
- Mechanics of Materials 165
Countries citing papers authored by C. Law
This map shows the geographic impact of C. Law's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. Law with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. Law more than expected).
Fields of papers citing papers by C. Law
This network shows the impact of papers produced by C. Law. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. Law. The network helps show where C. Law may publish in the future.
Co-authors
The 25 scholars most cited alongside C. Law, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | Properties of lead-free solder alloys with rare earth element additions Hit paper breakdown → | 2004 | 517 |
| 2 | 2002 | 110 | |
| 3 | 2004 | 99 | |
| 4 | 2003 | 97 | |
| 5 | 2002 | 83 | |
| 6 | 2004 | 81 | |
| 7 | 2006 | 80 | |
| 8 | 2004 | 71 | |
| 9 | 2002 | 57 | |
| 10 | 2004 | 45 | |
| 11 | 2011 | 23 | |
| 12 | 2005 | 16 | |
| 13 | 2004 | 12 | |
| 14 | 1997 | 7 | |
| 15 | 2001 | 7 | |
| 16 | 2004 | 5 | |
| 17 | 2002 | 3 | |
| 18 | 1998 | 2 | |
| 19 | 1998 | 1 | |
| 20 | Producing Web Pages that Everyone Can Access | 1999 | 1 |
About C. Law
C. Law is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Computational Mechanics, Aerospace Engineering and Fluid Flow and Transfer Processes, having authored 20 papers that have together received 1.3k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (12 papers), Intermetallics and Advanced Alloy Properties (6 papers), 3D IC and TSV technologies (5 papers), Combustion and flame dynamics (4 papers), Advanced Combustion Engine Technologies (4 papers), Aluminum Alloys Composites Properties (3 papers), Advanced Welding Techniques Analysis (3 papers) and Metallurgical and Alloy Processes (2 papers). The work is most often cited by research in General Materials Science (102 citations), Mechanical Engineering (930 citations), Electrical and Electronic Engineering (1.1k citations), Aerospace Engineering (218 citations) and Mechanics of Materials (165 citations). C. Law has collaborated with scholars based in Hong Kong, China and United States. Frequent co-authors include Chi‐Man Lawrence Wu, Daquan Yu, Lu Wang, J.K.L. Lai, K.T. Chau, R.H.C. Wong, Weishen Zhu, T.M. Yue, Chi Fai Cheung and K.C. Yung. Their work appears in journals such as Journal of Electronic Materials, Journal of Alloys and Compounds, International Journal of Rock Mechanics and Mining Sciences, Materials Science and Engineering R Reports and IEEE Transactions on Advanced Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.