E. Auerswald
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Silicon Carbide Semiconductor Technologies
- Electromagnetic Compatibility and Noise Suppression
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- Aluminum Alloys Composites Properties
- Advanced Welding Techniques Analysis
Papers in
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- Electronic Packaging and Soldering Technologies 7
- 3D IC and TSV technologies 6
- Advanced MEMS and NEMS Technologies 4
- Integrated Circuits and Semiconductor Failure Analysis 3
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- Advanced Surface Polishing Techniques 10
- Co-authors
- B. Michel (6 shared papers)H. Reichl (3 shared papers)R. Dudek (5 shared papers)Andreas Schubert (2 shared papers)Sven Rzepka (11 shared papers)D. Vogel (8 shared papers)Bernhard Wunderle (4 shared papers)Bernd Michel (6 shared papers)
- Journals
- Microelectronics Reliability (3 papers)Microsystem Technologies (1 paper)Materials science forum (3 papers)Crystal Research and Technology (1 paper)AIP conference proceedings (1 paper)
- Partner nations
- GermanyUnited KingdomFrance
In The Last Decade
E. Auerswald
22 papers receiving 370 citations
Peers
Comparison fields: 5 of 29
- Electrical and Electronic Engineering 361
- Mechanical Engineering 160
- Mechanics of Materials 82
- Ceramics and Composites 12
- Aerospace Engineering 49
Countries citing papers authored by E. Auerswald
This map shows the geographic impact of E. Auerswald's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E. Auerswald with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E. Auerswald more than expected).
Fields of papers citing papers by E. Auerswald
This network shows the impact of papers produced by E. Auerswald. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E. Auerswald. The network helps show where E. Auerswald may publish in the future.
Co-authors
The 22 scholars most cited alongside E. Auerswald, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 22 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2003 | 285 | |
| 2 | 2014 | 18 | |
| 3 | 2006 | 12 | |
| 4 | 2012 | 11 | |
| 5 | 1994 | 10 | |
| 6 | 2006 | 9 | |
| 7 | 2014 | 9 | |
| 8 | 2006 | 6 | |
| 9 | 2002 | 5 | |
| 10 | 2013 | 5 | |
| 11 | 2019 | 5 | |
| 12 | 2011 | 5 | |
| 13 | 1993 | 4 | |
| 14 | 2018 | 4 | |
| 15 | 2014 | 3 | |
| 16 | 2004 | 2 | |
| 17 | 2015 | 2 | |
| 18 | 2014 | 2 | |
| 19 | 2014 | 2 | |
| 20 | 2017 | 1 |
About E. Auerswald
E. Auerswald is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Mechanical Engineering, Mechanics of Materials and Computer Vision and Pattern Recognition, having authored 22 papers that have together received 402 indexed citations. Recurring topics across this work include Advanced Surface Polishing Techniques (10 papers), Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (6 papers), Advanced MEMS and NEMS Technologies (4 papers), Welding Techniques and Residual Stresses (3 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers), Metal and Thin Film Mechanics (2 papers) and Optical measurement and interference techniques (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (361 citations), Mechanical Engineering (160 citations), Mechanics of Materials (82 citations), Ceramics and Composites (12 citations) and Aerospace Engineering (49 citations). E. Auerswald has collaborated with scholars based in Germany, United Kingdom and France. Frequent co-authors include B. Michel, H. Reichl, R. Dudek, Andreas Schubert, Sven Rzepka, D. Vogel, Bernhard Wunderle, Bernd Michel, Astrid Gollhardt and Raúl D. Rodriguez. Their work appears in journals such as Microelectronics Reliability, Microsystem Technologies, Materials science forum, Crystal Research and Technology and AIP conference proceedings.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.