C.-Y. Li
Impact in
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- Copper Interconnects and Reliability
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- Electronic Packaging and Soldering Technologies
Papers in
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- Copper Interconnects and Reliability 24
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- Electronic Packaging and Soldering Technologies 21
- Co-authors
- Matt A. Korhonen (32 shared papers)P. Bo rgesen (4 shared papers)Peter Børgesen (18 shared papers)Peng Cheng Su (6 shared papers)Sven Rzepka (2 shared papers)Simo‐Pekka Hannula (2 shared papers)Sukwon Hong (5 shared papers)Tia-Marje K. Korhonen (5 shared papers)
- Journals
- Applied Physics Letters (5 papers)Journal of Electronic Materials (3 papers)Journal of Electronic Packaging (2 papers)Journal of materials research/Pratt's guide to venture capital sources (2 papers)Journal of Testing and Evaluation (1 paper)
- Partner nations
- United StatesGermanyFinland
In The Last Decade
C.-Y. Li
54 papers receiving 609 citations
Peers
Comparison fields: 5 of 26
- Electronic, Optical and Magnetic Materials 206
- Electrical and Electronic Engineering 313
- Mechanics of Materials 93
- General Materials Science 11
- Metals and Alloys 8
Countries citing papers authored by C.-Y. Li
This map shows the geographic impact of C.-Y. Li's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C.-Y. Li with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C.-Y. Li more than expected).
Fields of papers citing papers by C.-Y. Li
This network shows the impact of papers produced by C.-Y. Li. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C.-Y. Li. The network helps show where C.-Y. Li may publish in the future.
Co-authors
The 24 scholars most cited alongside C.-Y. Li, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 55 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2000 | 60 | |
| 2 | 1992 | 57 | |
| 3 | 1990 | 43 | |
| 4 | 1998 | 42 | |
| 5 | 1991 | 40 | |
| 6 | 1989 | 34 | |
| 7 | 1999 | 32 | |
| 8 | 1986 | 23 | |
| 9 | 1996 | 23 | |
| 10 | 1984 | 21 | |
| 11 | 1987 | 18 | |
| 12 | 1987 | 17 | |
| 13 | 1995 | 17 | |
| 14 | 1992 | 15 | |
| 15 | 1993 | 15 | |
| 16 | 1992 | 14 | |
| 17 | 1993 | 14 | |
| 18 | 1999 | 13 | |
| 19 | 1992 | 12 | |
| 20 | 1993 | 11 |
About C.-Y. Li
C.-Y. Li is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Mechanics of Materials, Metals and Alloys and Mechanical Engineering, having authored 55 papers that have together received 658 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (24 papers), Electronic Packaging and Soldering Technologies (21 papers), Metal and Thin Film Mechanics (4 papers), Fatigue and fracture mechanics (3 papers), Hydrogen embrittlement and corrosion behaviors in metals (2 papers), Metallurgy and Material Forming (2 papers), High Temperature Alloys and Creep (2 papers) and Engineering Education and Curriculum Development (1 paper). The work is most often cited by research in Electronic, Optical and Magnetic Materials (206 citations), Electrical and Electronic Engineering (313 citations), Mechanics of Materials (93 citations), General Materials Science (11 citations) and Metals and Alloys (8 citations). C.-Y. Li has collaborated with scholars based in United States, Germany and Finland. Frequent co-authors include Matt A. Korhonen, P. Bo rgesen, Peter Børgesen, Peng Cheng Su, Sven Rzepka, Simo‐Pekka Hannula, Sukwon Hong, Tia-Marje K. Korhonen, Timothy D. Sullivan and W. R. LaFontaine. Their work appears in journals such as Applied Physics Letters, Journal of Electronic Materials, Journal of Electronic Packaging, Journal of materials research/Pratt's guide to venture capital sources and Journal of Testing and Evaluation.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.