C.-Y. Li
Impact in
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- Copper Interconnects and Reliability
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Semiconductor materials and devices
Papers in
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- Electronic Packaging and Soldering Technologies 26
- 3D IC and TSV technologies 13
- Semiconductor materials and devices 5
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- Copper Interconnects and Reliability 17
- Co-authors
- M. A. Korhonen (25 shared papers)P. Bo rgesen (4 shared papers)Peter Børgesen (16 shared papers)Tia‐Marje Korhonen (6 shared papers)Sukwon Hong (5 shared papers)Peng Su (4 shared papers)D. D. Brown (10 shared papers)Timothy D. Sullivan (2 shared papers)
- Journals
- Applied Physics Letters (5 papers)Journal of Electronic Materials (2 papers)Journal of Electronic Packaging (2 papers)Scripta Materialia (1 paper)Journal of materials research/Pratt's guide to venture capital sources (1 paper)
- Partner nations
- United StatesAustraliaGermany
In The Last Decade
C.-Y. Li
43 papers receiving 459 citations
Peers
Comparison fields: 5 of 31
- Electronic, Optical and Magnetic Materials 198
- Electrical and Electronic Engineering 401
- Mechanical Engineering 187
- Mechanics of Materials 98
- General Materials Science 5
Countries citing papers authored by C.-Y. Li
This map shows the geographic impact of C.-Y. Li's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C.-Y. Li with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C.-Y. Li more than expected).
Fields of papers citing papers by C.-Y. Li
This network shows the impact of papers produced by C.-Y. Li. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C.-Y. Li. The network helps show where C.-Y. Li may publish in the future.
Co-authors
The 24 scholars most cited alongside C.-Y. Li, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 44 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2000 | 57 | |
| 2 | 1992 | 55 | |
| 3 | 1998 | 40 | |
| 4 | 1991 | 40 | |
| 5 | 1989 | 29 | |
| 6 | 1996 | 23 | |
| 7 | 1987 | 18 | |
| 8 | 1987 | 17 | |
| 9 | 1995 | 15 | |
| 10 | 1993 | 15 | |
| 11 | 1992 | 15 | |
| 12 | 1993 | 13 | |
| 13 | 1999 | 13 | |
| 14 | 1992 | 13 | |
| 15 | 1992 | 12 | |
| 16 | 1993 | 10 | |
| 17 | 1991 | 9 | |
| 18 | 1995 | 9 | |
| 19 | 2003 | 7 | |
| 20 | 1993 | 6 |
About C.-Y. Li
C.-Y. Li is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanical Engineering, Mechanics of Materials and Materials Chemistry, having authored 44 papers that have together received 487 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (26 papers), Copper Interconnects and Reliability (17 papers), 3D IC and TSV technologies (13 papers), Advanced Welding Techniques Analysis (6 papers), Semiconductor materials and devices (5 papers), Metal and Thin Film Mechanics (4 papers), Aluminum Alloy Microstructure Properties (4 papers) and Semiconductor materials and interfaces (4 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (198 citations), Electrical and Electronic Engineering (401 citations), Mechanical Engineering (187 citations), Mechanics of Materials (98 citations) and General Materials Science (5 citations). C.-Y. Li has collaborated with scholars based in United States, Australia and Germany. Frequent co-authors include M. A. Korhonen, P. Bo rgesen, Peter Børgesen, Tia‐Marje Korhonen, Sukwon Hong, Peng Su, D. D. Brown, Timothy D. Sullivan, J. W. Mayer and Sven Rzepka. Their work appears in journals such as Applied Physics Letters, Journal of Electronic Materials, Journal of Electronic Packaging, Scripta Materialia and Journal of materials research/Pratt's guide to venture capital sources.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.