Peng Su
Impact in
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- Copper Interconnects and Reliability
- Magnetic Properties and Applications
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electric Motor Design and Analysis
Papers in
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- Electronic Packaging and Soldering Technologies 54
- Electric Motor Design and Analysis 41
- 3D IC and TSV technologies 34
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- Magnetic Properties and Applications 19
- Copper Interconnects and Reliability 14
- Co-authors
- Wei Hua (22 shared papers)Ming Cheng (11 shared papers)Min Ding (10 shared papers)Paul S. Ho (10 shared papers)Zhe Chen (5 shared papers)Guanjun Wang (4 shared papers)M. A. Korhonen (6 shared papers)Fengjun Duan (2 shared papers)
- Journals
- IEEE Transactions on Electronics Packaging Manufacturing (6 papers)IEEE Transactions on Transportation Electrification (6 papers)IEEE Transactions on Industrial Electronics (6 papers)Journal of Electronic Materials (4 papers)Journal of Crystal Growth (3 papers)
- Partner nations
- ChinaUnited StatesTaiwan
In The Last Decade
Peng Su
121 papers receiving 1.4k citations
Peers
Comparison fields: 5 of 72
- Electronic, Optical and Magnetic Materials 411
- Electrical and Electronic Engineering 1.2k
- Safety, Risk, Reliability and Quality 140
- Software 62
- Control and Systems Engineering 327
Countries citing papers authored by Peng Su
This map shows the geographic impact of Peng Su's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Peng Su with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Peng Su more than expected).
Fields of papers citing papers by Peng Su
This network shows the impact of papers produced by Peng Su. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Peng Su. The network helps show where Peng Su may publish in the future.
Co-authors
The 25 scholars most cited alongside Peng Su, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 132 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2016 | 73 | |
| 2 | 2006 | 72 | |
| 3 | 2011 | 59 | |
| 4 | 2000 | 59 | |
| 5 | 2017 | 56 | |
| 6 | 2006 | 54 | |
| 7 | 2007 | 47 | |
| 8 | 2020 | 45 | |
| 9 | 2012 | 45 | |
| 10 | 2021 | 42 | |
| 11 | 2018 | 39 | |
| 12 | 2006 | 39 | |
| 13 | 2019 | 38 | |
| 14 | 2012 | 36 | |
| 15 | 2020 | 33 | |
| 16 | 2006 | 33 | |
| 17 | 1999 | 31 | |
| 18 | 2017 | 30 | |
| 19 | 2006 | 30 | |
| 20 | 2017 | 30 |
About Peng Su
Peng Su is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Control and Systems Engineering, Mechanical Engineering and Biomedical Engineering, having authored 132 papers that have together received 1.5k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (54 papers), Electric Motor Design and Analysis (41 papers), 3D IC and TSV technologies (34 papers), Magnetic Bearings and Levitation Dynamics (29 papers), Magnetic Properties and Applications (19 papers), Copper Interconnects and Reliability (14 papers), Advanced Welding Techniques Analysis (11 papers) and Aluminum Alloy Microstructure Properties (9 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (411 citations), Electrical and Electronic Engineering (1.2k citations), Safety, Risk, Reliability and Quality (140 citations), Software (62 citations) and Control and Systems Engineering (327 citations). Peng Su has collaborated with scholars based in China, United States and Taiwan. Frequent co-authors include Wei Hua, Ming Cheng, Min Ding, Paul S. Ho, Zhe Chen, Guanjun Wang, M. A. Korhonen, Fengjun Duan, Minghao Tong and Zhongze Wu. Their work appears in journals such as IEEE Transactions on Electronics Packaging Manufacturing, IEEE Transactions on Transportation Electrification, IEEE Transactions on Industrial Electronics, Journal of Electronic Materials and Journal of Crystal Growth.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.