W. Robl
Impact in
- Mechanics of Materials top 10%
- Metal and Thin Film Mechanics
-
- Copper Interconnects and Reliability
Papers in
-
- Electrodeposition and Electroless Coatings 7
- Semiconductor materials and devices 6
- Electronic Packaging and Soldering Technologies 5
- Advancements in Semiconductor Devices and Circuit Design 4
- Ferroelectric and Negative Capacitance Devices 3
-
- Metal and Thin Film Mechanics 10
- Co-authors
- Gerhard Dehm (8 shared papers)Thomas Detzel (8 shared papers)W. Heinz (7 shared papers)Rui Huang (3 shared papers)H. Ceric (3 shared papers)Christian Motz (2 shared papers)Alexander Leitner (2 shared papers)Michael Nelhiebel (5 shared papers)
- Journals
- Acta Materialia (3 papers)Microelectronics Reliability (3 papers)Journal of Applied Electrochemistry (2 papers)Microelectronic Engineering (2 papers)IEEE Electron Device Letters (1 paper)
- Partner nations
- GermanyAustriaUnited States
In The Last Decade
W. Robl
26 papers receiving 338 citations
Peers
Comparison fields: 5 of 30
- Mechanics of Materials 159
- Electronic, Optical and Magnetic Materials 111
- Metals and Alloys 9
- Electrical and Electronic Engineering 172
- Materials Chemistry 138
Countries citing papers authored by W. Robl
This map shows the geographic impact of W. Robl's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by W. Robl with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites W. Robl more than expected).
Fields of papers citing papers by W. Robl
This network shows the impact of papers produced by W. Robl. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by W. Robl. The network helps show where W. Robl may publish in the future.
Co-authors
The 25 scholars most cited alongside W. Robl, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 26 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2009 | 50 | |
| 2 | 2014 | 35 | |
| 3 | 2011 | 34 | |
| 4 | 2014 | 33 | |
| 5 | 2014 | 32 | |
| 6 | 2013 | 29 | |
| 7 | 2012 | 25 | |
| 8 | 1993 | 22 | |
| 9 | 2015 | 13 | |
| 10 | 2008 | 13 | |
| 11 | 2017 | 10 | |
| 12 | 2014 | 9 | |
| 13 | 2014 | 7 | |
| 14 | 2019 | 6 | |
| 15 | 2017 | 5 | |
| 16 | 2007 | 3 | |
| 17 | 2002 | 3 | |
| 18 | 2010 | 3 | |
| 19 | 2011 | 3 | |
| 20 | 2017 | 2 |
About W. Robl
W. Robl is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Electronic, Optical and Magnetic Materials, Materials Chemistry and Atomic and Molecular Physics, and Optics, having authored 26 papers that have together received 345 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (11 papers), Metal and Thin Film Mechanics (10 papers), Electrodeposition and Electroless Coatings (7 papers), Microstructure and mechanical properties (6 papers), Semiconductor materials and devices (6 papers), Electronic Packaging and Soldering Technologies (5 papers), Advancements in Semiconductor Devices and Circuit Design (4 papers) and Ferroelectric and Negative Capacitance Devices (3 papers). The work is most often cited by research in Mechanics of Materials (159 citations), Electronic, Optical and Magnetic Materials (111 citations), Metals and Alloys (9 citations), Electrical and Electronic Engineering (172 citations) and Materials Chemistry (138 citations). W. Robl has collaborated with scholars based in Germany, Austria and United States. Frequent co-authors include Gerhard Dehm, Thomas Detzel, W. Heinz, Rui Huang, H. Ceric, Christian Motz, Alexander Leitner, Michael Nelhiebel, Christoph Kirchlechner and Stefan Decker. Their work appears in journals such as Acta Materialia, Microelectronics Reliability, Journal of Applied Electrochemistry, Microelectronic Engineering and IEEE Electron Device Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.