Peter Børgesen
Impact in
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electrodeposition and Electroless Coatings
- General Materials Science top 0.5%
Papers in
-
- Electronic Packaging and Soldering Technologies 119
- 3D IC and TSV technologies 43
-
- Advanced Welding Techniques Analysis 20
- Co-authors
- Liang Yin (20 shared papers)E. J. Cotts (22 shared papers)Sa’d Hamasha (13 shared papers)Luke Wentlent (22 shared papers)B.M.U. Scherzer (14 shared papers)Awni Qasaimeh (12 shared papers)Nikolay Dimitrov (18 shared papers)W. Möller (10 shared papers)
- Journals
- Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms (13 papers)Journal of Electronic Packaging (13 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (11 papers)Journal of Electronic Materials (10 papers)Microelectronics Reliability (6 papers)
- Partner nations
- United StatesGermanyDenmark
In The Last Decade
Peter Børgesen
209 papers receiving 3.2k citations
Peers
Comparison fields: 5 of 78
- Electrical and Electronic Engineering 2.4k
- General Materials Science 121
- Mechanical Engineering 1.3k
- Mechanics of Materials 601
- Radiation 201
Countries citing papers authored by Peter Børgesen
This map shows the geographic impact of Peter Børgesen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Peter Børgesen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Peter Børgesen more than expected).
Fields of papers citing papers by Peter Børgesen
This network shows the impact of papers produced by Peter Børgesen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Peter Børgesen. The network helps show where Peter Børgesen may publish in the future.
Co-authors
The 25 scholars most cited alongside Peter Børgesen, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 214 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 157 | |
| 2 | 2017 | 130 | |
| 3 | 2001 | 109 | |
| 4 | Beam-solid interactions, physical phenomena | 1990 | 107 |
| 5 | 2011 | 99 | |
| 6 | 2016 | 98 | |
| 7 | 2011 | 96 | |
| 8 | 2008 | 75 | |
| 9 | 1987 | 54 | |
| 10 | 1986 | 50 | |
| 11 | 2007 | 50 | |
| 12 | 2022 | 49 | |
| 13 | 2014 | 48 | |
| 14 | 2016 | 44 | |
| 15 | 1978 | 43 | |
| 16 | 2018 | 43 | |
| 17 | 2008 | 43 | |
| 18 | 2015 | 43 | |
| 19 | 2013 | 41 | |
| 20 | 2010 | 40 |
About Peter Børgesen
Peter Børgesen is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Materials Chemistry and Aerospace Engineering, having authored 214 papers that have together received 3.4k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (119 papers), 3D IC and TSV technologies (43 papers), Ion-surface interactions and analysis (24 papers), Aluminum Alloy Microstructure Properties (22 papers), Advanced Welding Techniques Analysis (20 papers), Copper Interconnects and Reliability (20 papers), Fusion materials and technologies (19 papers) and Additive Manufacturing and 3D Printing Technologies (17 papers). The work is most often cited by research in Electrical and Electronic Engineering (2.4k citations), General Materials Science (121 citations), Mechanical Engineering (1.3k citations), Mechanics of Materials (601 citations) and Radiation (201 citations). Peter Børgesen has collaborated with scholars based in United States, Germany and Denmark. Frequent co-authors include Liang Yin, E. J. Cotts, Sa’d Hamasha, Luke Wentlent, B.M.U. Scherzer, Awni Qasaimeh, Nikolay Dimitrov, W. Möller, L. Zavalij and Babak Arfaei. Their work appears in journals such as Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms, Journal of Electronic Packaging, IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of Electronic Materials and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.