Peter Børgesen
Impact in
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- Electronic Packaging and Soldering Technologies
- Nanomaterials and Printing Technologies
- Electrodeposition and Electroless Coatings
- 3D IC and TSV technologies
- Computational Mechanics top 2%
- Ion-surface interactions and analysis
Papers in
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- Electronic Packaging and Soldering Technologies 115
- Nanomaterials and Printing Technologies 19
- Electrodeposition and Electroless Coatings 10
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- Ion-surface interactions and analysis 30
- Co-authors
- Liang Yin (20 shared papers)Eric J. Cotts (22 shared papers)Sa’d Hamasha (13 shared papers)Luke A. Wentlent (22 shared papers)Bernhard M. U. Scherzer (15 shared papers)Awni Qasaimeh (12 shared papers)Nikolay Dimitrov (18 shared papers)W. Möller (11 shared papers)
- Journals
- Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms (13 papers)Journal of Electronic Packaging (13 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (11 papers)Journal of Electronic Materials (10 papers)Journal of Nuclear Materials (6 papers)
- Partner nations
- United StatesGermanyDenmark
In The Last Decade
Peter Børgesen
215 papers receiving 3.3k citations
Peers
Comparison fields: 5 of 63
- Electrical and Electronic Engineering 2.4k
- Computational Mechanics 379
- Automotive Engineering 127
- Materials Chemistry 427
- Surfaces, Coatings and Films 54
Countries citing papers authored by Peter Børgesen
This map shows the geographic impact of Peter Børgesen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Peter Børgesen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Peter Børgesen more than expected).
Fields of papers citing papers by Peter Børgesen
This network shows the impact of papers produced by Peter Børgesen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Peter Børgesen. The network helps show where Peter Børgesen may publish in the future.
Co-authors
The 25 scholars most cited alongside Peter Børgesen, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 217 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 155 | |
| 2 | 2017 | 130 | |
| 3 | 2001 | 109 | |
| 4 | Beam-solid interactions, physical phenomena | 1990 | 107 |
| 5 | 2011 | 104 | |
| 6 | 2016 | 100 | |
| 7 | 2011 | 97 | |
| 8 | 2008 | 75 | |
| 9 | 1987 | 54 | |
| 10 | 2007 | 52 | |
| 11 | 2022 | 52 | |
| 12 | 1986 | 51 | |
| 13 | 2014 | 49 | |
| 14 | 2015 | 44 | |
| 15 | 2016 | 44 | |
| 16 | 2018 | 44 | |
| 17 | 1978 | 42 | |
| 18 | 2008 | 42 | |
| 19 | 2013 | 41 | |
| 20 | 2010 | 39 |
About Peter Børgesen
Peter Børgesen is a scholar working on Electrical and Electronic Engineering, Computational Mechanics, Electronic, Optical and Magnetic Materials, Materials Chemistry and Surfaces, Coatings and Films, having authored 217 papers that have together received 3.5k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (115 papers), Ion-surface interactions and analysis (30 papers), Fusion materials and technologies (27 papers), Copper Interconnects and Reliability (25 papers), Nanomaterials and Printing Technologies (19 papers), Electrodeposition and Electroless Coatings (10 papers), Electron and X-Ray Spectroscopy Techniques (8 papers) and Additive Manufacturing and 3D Printing Technologies (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (2.4k citations), Computational Mechanics (379 citations), Automotive Engineering (127 citations), Materials Chemistry (427 citations) and Surfaces, Coatings and Films (54 citations). Peter Børgesen has collaborated with scholars based in United States, Germany and Denmark. Frequent co-authors include Liang Yin, Eric J. Cotts, Sa’d Hamasha, Luke A. Wentlent, Bernhard M. U. Scherzer, Awni Qasaimeh, Nikolay Dimitrov, W. Möller, Babak Arfaei and Lubov Zavalij. Their work appears in journals such as Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms, Journal of Electronic Packaging, IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of Electronic Materials and Journal of Nuclear Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.