D. D. Brown
Impact in
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- Copper Interconnects and Reliability
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- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- 3D IC and TSV technologies
Papers in
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- Electronic Packaging and Soldering Technologies 19
- Semiconductor materials and devices 14
- 3D IC and TSV technologies 4
- Integrated Circuits and Semiconductor Failure Analysis 3
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- Copper Interconnects and Reliability 22
- Co-authors
- Randall Olsen (1 shared paper)M. A. Korhonen (19 shared papers)Che‐Yu Li (5 shared papers)P. Bo rgesen (1 shared paper)C.-Y. Li (10 shared papers)Claus Pade (2 shared papers)S. K. Sahu (2 shared papers)N. Thaulow (2 shared papers)
- Journals
- English Journal of the English Association (1 paper)Journal of Electronic Materials (1 paper)Thin Solid Films (1 paper)Applied Physics Letters (1 paper)Journal of Applied Physics (1 paper)
- Partner nations
- United StatesCanadaAustralia
In The Last Decade
D. D. Brown
29 papers receiving 420 citations
Peers
Comparison fields: 5 of 38
- Electronic, Optical and Magnetic Materials 232
- Electrical and Electronic Engineering 261
- Civil and Structural Engineering 86
- Mechanical Engineering 117
- Materials Chemistry 125
Countries citing papers authored by D. D. Brown
This map shows the geographic impact of D. D. Brown's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. D. Brown with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. D. Brown more than expected).
Fields of papers citing papers by D. D. Brown
This network shows the impact of papers produced by D. D. Brown. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. D. Brown. The network helps show where D. D. Brown may publish in the future.
Co-authors
The 25 scholars most cited alongside D. D. Brown, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 31 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1982 | 114 | |
| 2 | 1993 | 93 | |
| 3 | 2006 | 83 | |
| 4 | 2000 | 35 | |
| 5 | 1995 | 18 | |
| 6 | 1995 | 16 | |
| 7 | 1992 | 12 | |
| 8 | 1995 | 9 | |
| 9 | 1991 | 9 | |
| 10 | 1998 | 7 | |
| 11 | 1993 | 6 | |
| 12 | 1994 | 5 | |
| 13 | 1994 | 5 | |
| 14 | 1996 | 5 | |
| 15 | 2002 | 5 | |
| 16 | The rapidair system for air void analysis of hardened concrete - A round robin study | 2005 | 5 |
| 17 | 2000 | 4 | |
| 18 | 1993 | 4 | |
| 19 | 1994 | 4 | |
| 20 | 1993 | 3 |
About D. D. Brown
D. D. Brown is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials, Atomic and Molecular Physics, and Optics and Mechanical Engineering, having authored 31 papers that have together received 459 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (22 papers), Electronic Packaging and Soldering Technologies (19 papers), Semiconductor materials and devices (14 papers), Metal and Thin Film Mechanics (7 papers), 3D IC and TSV technologies (4 papers), Semiconductor materials and interfaces (3 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers) and Metal Forming Simulation Techniques (2 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (232 citations), Electrical and Electronic Engineering (261 citations), Civil and Structural Engineering (86 citations), Mechanical Engineering (117 citations) and Materials Chemistry (125 citations). D. D. Brown has collaborated with scholars based in United States, Canada and Australia. Frequent co-authors include Randall Olsen, M. A. Korhonen, Che‐Yu Li, P. Bo rgesen, C.-Y. Li, Claus Pade, S. K. Sahu, N. Thaulow, Peter Børgesen and Ulla Jakobsen. Their work appears in journals such as English Journal of the English Association, Journal of Electronic Materials, Thin Solid Films, Applied Physics Letters and Journal of Applied Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.