H. Berg
Impact in
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Silicon Carbide Semiconductor Technologies
- General Materials Science top 10%
Papers in
-
- Electronic Packaging and Soldering Technologies 18
- 3D IC and TSV technologies 8
- Electrostatic Discharge in Electronics 4
- Semiconductor Lasers and Optical Devices 3
- Integrated Circuits and Semiconductor Failure Analysis 3
-
- Advanced optical system design 3
- Co-authors
- J. B. Cohen (3 shared papers)Gary L. Lewis (6 shared papers)W. M. Paulson (1 shared paper)C. A. Mitchell (3 shared papers)G. Ganesan (2 shared papers)M. Mahalingam (2 shared papers)David L. Shealy (2 shared papers)Tien T. Tsong (1 shared paper)
- Journals
- Journal of Electronic Materials (1 paper)Materials Chemistry and Physics (1 paper)IEEE Transactions on Electron Devices (1 paper)Microelectronics Reliability (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology Part A (1 paper)
- Partner nations
- United States
In The Last Decade
H. Berg
27 papers receiving 458 citations
Peers
Comparison fields: 5 of 43
- Electrical and Electronic Engineering 381
- General Materials Science 15
- Mechanics of Materials 115
- Mechanical Engineering 141
- Electronic, Optical and Magnetic Materials 40
Countries citing papers authored by H. Berg
This map shows the geographic impact of H. Berg's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H. Berg with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H. Berg more than expected).
Fields of papers citing papers by H. Berg
This network shows the impact of papers produced by H. Berg. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H. Berg. The network helps show where H. Berg may publish in the future.
Co-authors
The 12 scholars most cited alongside H. Berg, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 28 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1972 | 58 | |
| 2 | 1978 | 53 | |
| 3 | 1979 | 51 | |
| 4 | 1981 | 39 | |
| 5 | 1987 | 37 | |
| 6 | 1993 | 36 | |
| 7 | 1987 | 26 | |
| 8 | 1975 | 22 | |
| 9 | 1980 | 21 | |
| 10 | 1994 | 19 | |
| 11 | 1995 | 15 | |
| 12 | 1973 | 13 | |
| 13 | 2002 | 11 | |
| 14 | 2002 | 11 | |
| 15 | 1979 | 11 | |
| 16 | 1973 | 10 | |
| 17 | 2002 | 10 | |
| 18 | 1996 | 9 | |
| 19 | 1983 | 8 | |
| 20 | 2002 | 8 |
About H. Berg
H. Berg is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Mechanical Engineering, Mechanics of Materials and General Materials Science, having authored 28 papers that have together received 502 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (8 papers), Electrostatic Discharge in Electronics (4 papers), Metallurgical and Alloy Processes (4 papers), Semiconductor Lasers and Optical Devices (3 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers), Advanced optical system design (3 papers) and Advanced Welding Techniques Analysis (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (381 citations), General Materials Science (15 citations), Mechanics of Materials (115 citations), Mechanical Engineering (141 citations) and Electronic, Optical and Magnetic Materials (40 citations). H. Berg has collaborated with scholars based in United States. Frequent co-authors include J. B. Cohen, Gary L. Lewis, W. M. Paulson, C. A. Mitchell, G. Ganesan, M. Mahalingam, David L. Shealy, Tien T. Tsong, Jay Liu and Thomas A. Anderson. Their work appears in journals such as Journal of Electronic Materials, Materials Chemistry and Physics, IEEE Transactions on Electron Devices, Microelectronics Reliability and IEEE Transactions on Components Packaging and Manufacturing Technology Part A.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.