Si Chen
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Semiconductor materials and devices
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- Aluminum Alloys Composites Properties
Papers in
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- Electronic Packaging and Soldering Technologies 49
- 3D IC and TSV technologies 44
- Integrated Circuits and Semiconductor Failure Analysis 10
- Semiconductor materials and devices 9
- Electric Motor Design and Analysis 8
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- Advanced Welding Techniques Analysis 7
- Aluminum Alloys Composites Properties 7
- Co-authors
- Tong An (16 shared papers)Fei Qin (14 shared papers)Pei Chen (5 shared papers)Johan Liu (12 shared papers)Yun Huang (9 shared papers)Hongtao Chen (6 shared papers)Xiaofeng Yang (6 shared papers)Zhiwei Fu (12 shared papers)
- Journals
- Materials (5 papers)Microelectronics Reliability (4 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)Journal of Electronic Materials (2 papers)IEEE Transactions on Plasma Science (1 paper)
- Partner nations
- ChinaSwedenUnited States
In The Last Decade
Si Chen
75 papers receiving 441 citations
Peers
Comparison fields: 5 of 51
- Electrical and Electronic Engineering 366
- Mechanical Engineering 122
- Electronic, Optical and Magnetic Materials 52
- Automotive Engineering 28
- Biomedical Engineering 96
Countries citing papers authored by Si Chen
This map shows the geographic impact of Si Chen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Si Chen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Si Chen more than expected).
Fields of papers citing papers by Si Chen
This network shows the impact of papers produced by Si Chen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Si Chen. The network helps show where Si Chen may publish in the future.
Co-authors
The 25 scholars most cited alongside Si Chen, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 89 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2023 | 31 | |
| 2 | 2010 | 27 | |
| 3 | 2016 | 27 | |
| 4 | 2018 | 18 | |
| 5 | 2018 | 17 | |
| 6 | 2022 | 15 | |
| 7 | 2020 | 15 | |
| 8 | 2020 | 14 | |
| 9 | 2016 | 14 | |
| 10 | 2011 | 12 | |
| 11 | 2021 | 12 | |
| 12 | 2024 | 12 | |
| 13 | 2017 | 12 | |
| 14 | 2012 | 11 | |
| 15 | 2020 | 11 | |
| 16 | 2020 | 9 | |
| 17 | 2021 | 9 | |
| 18 | 2011 | 9 | |
| 19 | 2011 | 8 | |
| 20 | 2021 | 8 |
About Si Chen
Si Chen is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering and Control and Systems Engineering, having authored 89 papers that have together received 454 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (49 papers), 3D IC and TSV technologies (44 papers), Copper Interconnects and Reliability (11 papers), Integrated Circuits and Semiconductor Failure Analysis (10 papers), Semiconductor materials and devices (9 papers), Electric Motor Design and Analysis (8 papers), Advanced Welding Techniques Analysis (7 papers) and Aluminum Alloys Composites Properties (7 papers). The work is most often cited by research in Electrical and Electronic Engineering (366 citations), Mechanical Engineering (122 citations), Electronic, Optical and Magnetic Materials (52 citations), Automotive Engineering (28 citations) and Biomedical Engineering (96 citations). Si Chen has collaborated with scholars based in China, Sweden and United States. Frequent co-authors include Tong An, Fei Qin, Pei Chen, Johan Liu, Yun Huang, Hongtao Chen, Xiaofeng Yang, Zhiwei Fu, Qijie Zhai and Yulai Gao. Their work appears in journals such as Materials, Microelectronics Reliability, IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of Electronic Materials and IEEE Transactions on Plasma Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.