Anthony Primavera
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Mechanical Engineering top 10%
- Advanced Welding Techniques Analysis
- Intermetallics and Advanced Alloy Properties
- Aluminum Alloys Composites Properties
Papers in
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- Electronic Packaging and Soldering Technologies 14
- 3D IC and TSV technologies 10
- Integrated Circuits and Semiconductor Failure Analysis 4
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- Metal Forming Simulation Techniques 3
- Intermetallics and Advanced Alloy Properties 2
- Advanced Welding Techniques Analysis 1
- Co-authors
- James M. Pitarresi (5 shared papers)K. Srihari (6 shared papers)Richard Coyle (3 shared papers)M. A. Yunus (1 shared paper)A. Zribi (2 shared papers)L. Zavalij (2 shared papers)G.R. Westby (2 shared papers)E. J. Cotts (2 shared papers)
- Journals
- IEEE Transactions on Components and Packaging Technologies (1 paper)Journal of Electronic Packaging (1 paper)The International Journal of Advanced Manufacturing Technology (1 paper)Microelectronics Reliability (1 paper)Journal of Electronics Manufacturing (2 papers)
- Partner nations
- United States
In The Last Decade
Anthony Primavera
14 papers receiving 323 citations
Peers
Comparison fields: 5 of 33
- Electrical and Electronic Engineering 302
- Mechanical Engineering 177
- General Materials Science 14
- Mechanics of Materials 64
- Industrial and Manufacturing Engineering 18
Countries citing papers authored by Anthony Primavera
This map shows the geographic impact of Anthony Primavera's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Anthony Primavera with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Anthony Primavera more than expected).
Fields of papers citing papers by Anthony Primavera
This network shows the impact of papers produced by Anthony Primavera. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Anthony Primavera. The network helps show where Anthony Primavera may publish in the future.
Co-authors
The 12 scholars most cited alongside Anthony Primavera, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2003 | 129 | |
| 2 | 2000 | 52 | |
| 3 | 1992 | 45 | |
| 4 | 2003 | 40 | |
| 5 | 2002 | 32 | |
| 6 | 2002 | 13 | |
| 7 | 2000 | 9 | |
| 8 | 2002 | 7 | |
| 9 | 2005 | 6 | |
| 10 | 2003 | 5 | |
| 11 | 2004 | 4 | |
| 12 | Assembly and reliability of a wafer level CSP | 2001 | 2 |
| 13 | 1997 | 1 | |
| 14 | 1997 | 1 |
About Anthony Primavera
Anthony Primavera is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Aerospace Engineering, Mechanics of Materials and Hardware and Architecture, having authored 14 papers that have together received 346 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (10 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers), Metal Forming Simulation Techniques (3 papers), Aluminum Alloy Microstructure Properties (2 papers), Intermetallics and Advanced Alloy Properties (2 papers), Advanced Welding Techniques Analysis (1 paper) and VLSI and Analog Circuit Testing (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (302 citations), Mechanical Engineering (177 citations), General Materials Science (14 citations), Mechanics of Materials (64 citations) and Industrial and Manufacturing Engineering (18 citations). Anthony Primavera has collaborated with scholars based in United States. Frequent co-authors include James M. Pitarresi, K. Srihari, Richard Coyle, M. A. Yunus, A. Zribi, L. Zavalij, G.R. Westby, E. J. Cotts, Richard R. Chromik and Nathan Gnanasambandam. Their work appears in journals such as IEEE Transactions on Components and Packaging Technologies, Journal of Electronic Packaging, The International Journal of Advanced Manufacturing Technology, Microelectronics Reliability and Journal of Electronics Manufacturing.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.