A. Syed
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Electromagnetic Compatibility and Noise Suppression
- Silicon Carbide Semiconductor Technologies
- Mechanical Engineering top 10%
- Aluminum Alloys Composites Properties
- Advanced Welding Techniques Analysis
Papers in
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- Electronic Packaging and Soldering Technologies 14
- 3D IC and TSV technologies 9
-
- Aluminum Alloys Composites Properties 2
- High Temperature Alloys and Creep 2
- Co-authors
- Seung Mo Kim (4 shared papers)Wei Lin (2 shared papers)Toni T. Mattila (1 shared paper)J.K. Kivilahti (1 shared paper)Jin‐Young Kim (2 shared papers)Chang Woo Kim (1 shared paper)Robert Darveaux (2 shared papers)Jesse Galloway (2 shared papers)
- Journals
- Engineering Structures (2 papers)Journal of Composites for Construction (1 paper)IEEE Transactions on Electronics Packaging Manufacturing (1 paper)IEEE Transactions on Components and Packaging Technologies (1 paper)Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) (1 paper)
- Partner nations
- United StatesGermanyFinland
In The Last Decade
A. Syed
18 papers receiving 589 citations
Peers
Comparison fields: 5 of 28
- Electrical and Electronic Engineering 579
- Mechanical Engineering 243
- Mechanics of Materials 100
- Statistics, Probability and Uncertainty 29
- Aerospace Engineering 90
Countries citing papers authored by A. Syed
This map shows the geographic impact of A. Syed's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by A. Syed with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites A. Syed more than expected).
Fields of papers citing papers by A. Syed
This network shows the impact of papers produced by A. Syed. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by A. Syed. The network helps show where A. Syed may publish in the future.
Co-authors
The 10 scholars most cited alongside A. Syed, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 271 | |
| 2 | 2002 | 98 | |
| 3 | 2006 | 53 | |
| 4 | 2007 | 41 | |
| 5 | 2002 | 33 | |
| 6 | 2005 | 27 | |
| 7 | 2003 | 22 | |
| 8 | 2007 | 19 | |
| 9 | 2005 | 19 | |
| 10 | 2008 | 15 | |
| 11 | 2004 | 8 | |
| 12 | 2023 | 6 | |
| 13 | 2004 | 2 | |
| 14 | 2010 | 2 | |
| 15 | 2023 | 1 | |
| 16 | 2025 | 1 | |
| 17 | 2025 | 1 | |
| 18 | 2004 | 1 |
About A. Syed
A. Syed is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Aerospace Engineering, Civil and Structural Engineering and Building and Construction, having authored 18 papers that have together received 620 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (9 papers), Aluminum Alloy Microstructure Properties (5 papers), Structural Behavior of Reinforced Concrete (4 papers), Structural Load-Bearing Analysis (4 papers), Concrete Corrosion and Durability (3 papers), Aluminum Alloys Composites Properties (2 papers) and High Temperature Alloys and Creep (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (579 citations), Mechanical Engineering (243 citations), Mechanics of Materials (100 citations), Statistics, Probability and Uncertainty (29 citations) and Aerospace Engineering (90 citations). A. Syed has collaborated with scholars based in United States, Germany and Finland. Frequent co-authors include Seung Mo Kim, Wei Lin, Toni T. Mattila, J.K. Kivilahti, Jin‐Young Kim, Chang Woo Kim, Robert Darveaux, Jesse Galloway, Sungsu Park and Jae-Dong Kim. Their work appears in journals such as Engineering Structures, Journal of Composites for Construction, IEEE Transactions on Electronics Packaging Manufacturing, IEEE Transactions on Components and Packaging Technologies and Additional Conferences (Device Packaging HiTEC HiTEN & CICMT).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.