Richard Coyle
Impact in
- General Materials Science top 2%
- Metallurgical and Alloy Processes
- Mechanical Engineering top 5%
- Advanced Welding Techniques Analysis
- Aluminum Alloys Composites Properties
- Intermetallics and Advanced Alloy Properties
Papers in
-
- Electronic Packaging and Soldering Technologies 48
- 3D IC and TSV technologies 29
- Integrated Circuits and Semiconductor Failure Analysis 9
-
- Advanced Welding Techniques Analysis 9
- High Temperature Alloys and Creep 6
- Aluminum Alloys Composites Properties 5
- Co-authors
- Babak Arfaei (9 shared papers)Jeff Punch (4 shared papers)Maurice N. Collins (4 shared papers)C.M. Gourlay (5 shared papers)Jingwei Xian (4 shared papers)Anthony Primavera (3 shared papers)Fionn P.E. Dunne (3 shared papers)Yilun Xu (3 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)Metallurgical Transactions A (2 papers)IEEE Transactions on Components and Packaging Technologies (2 papers)Journal of Electronic Materials (2 papers)JOM (2 papers)
- Partner nations
- United StatesUnited KingdomJapan
In The Last Decade
Richard Coyle
59 papers receiving 752 citations
Peers
Comparison fields: 5 of 44
- General Materials Science 52
- Mechanical Engineering 440
- Electrical and Electronic Engineering 679
- Metals and Alloys 25
- Aerospace Engineering 151
Countries citing papers authored by Richard Coyle
This map shows the geographic impact of Richard Coyle's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Richard Coyle with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Richard Coyle more than expected).
Fields of papers citing papers by Richard Coyle
This network shows the impact of papers produced by Richard Coyle. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Richard Coyle. The network helps show where Richard Coyle may publish in the future.
Co-authors
The 25 scholars most cited alongside Richard Coyle, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 64 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2015 | 75 | |
| 2 | 2002 | 57 | |
| 3 | 2022 | 50 | |
| 4 | 2000 | 49 | |
| 5 | 2012 | 40 | |
| 6 | 2011 | 39 | |
| 7 | 2003 | 38 | |
| 8 | 2011 | 35 | |
| 9 | 2013 | 33 | |
| 10 | 2009 | 28 | |
| 11 | 1991 | 23 | |
| 12 | 2024 | 22 | |
| 13 | 2002 | 22 | |
| 14 | 2003 | 21 | |
| 15 | 2018 | 21 | |
| 16 | 2002 | 17 | |
| 17 | 2020 | 16 | |
| 18 | 1981 | 16 | |
| 19 | 2018 | 13 | |
| 20 | 2003 | 13 |
About Richard Coyle
Richard Coyle is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Aerospace Engineering, Mechanics of Materials and General Materials Science, having authored 64 papers that have together received 800 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (48 papers), 3D IC and TSV technologies (29 papers), Aluminum Alloy Microstructure Properties (9 papers), Integrated Circuits and Semiconductor Failure Analysis (9 papers), Advanced Welding Techniques Analysis (9 papers), High Temperature Alloys and Creep (6 papers), Aluminum Alloys Composites Properties (5 papers) and Metallurgical and Alloy Processes (5 papers). The work is most often cited by research in General Materials Science (52 citations), Mechanical Engineering (440 citations), Electrical and Electronic Engineering (679 citations), Metals and Alloys (25 citations) and Aerospace Engineering (151 citations). Richard Coyle has collaborated with scholars based in United States, United Kingdom and Japan. Frequent co-authors include Babak Arfaei, Jeff Punch, Maurice N. Collins, C.M. Gourlay, Jingwei Xian, Anthony Primavera, Fionn P.E. Dunne, Yilun Xu, Charles W. Buffington and Stoyan Stoyanov. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Metallurgical Transactions A, IEEE Transactions on Components and Packaging Technologies, Journal of Electronic Materials and JOM.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.