E. Pek
Impact in
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electrostatic Discharge in Electronics
- Integrated Circuits and Semiconductor Failure Analysis
- Electromagnetic Compatibility and Noise Suppression
- Mechanics of Materials top 5%
- Material Properties and Processing
Papers in
-
- 3D IC and TSV technologies 9
- Electronic Packaging and Soldering Technologies 9
- Electrostatic Discharge in Electronics 7
-
- Material Properties and Processing 2
- Co-authors
- Tong Yan Tee (9 shared papers)Chwee Teck Lim (9 shared papers)Z.W. Zhong (7 shared papers)Jing-en Luan (6 shared papers)Hun Shen Ng (2 shared papers)Jiang Zhou (1 shared paper)V.B.C. Tan (1 shared paper)
- Journals
- Microelectronics Reliability (2 papers)IEEE Transactions on Components and Packaging Technologies (1 paper)
- Partner nations
- SingaporeSwitzerlandUnited States
In The Last Decade
E. Pek
9 papers receiving 590 citations
Peers
Comparison fields: 5 of 25
- Electrical and Electronic Engineering 602
- Mechanics of Materials 229
- Mechanical Engineering 97
- Civil and Structural Engineering 39
- Hardware and Architecture 12
Countries citing papers authored by E. Pek
This map shows the geographic impact of E. Pek's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E. Pek with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E. Pek more than expected).
Fields of papers citing papers by E. Pek
This network shows the impact of papers produced by E. Pek. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E. Pek. The network helps show where E. Pek may publish in the future.
Co-authors
The 7 scholars most cited alongside E. Pek, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 162 | |
| 2 | 2004 | 130 | |
| 3 | 2004 | 98 | |
| 4 | 2004 | 79 | |
| 5 | 2004 | 70 | |
| 6 | 2006 | 59 | |
| 7 | 2007 | 33 | |
| 8 | 2006 | 5 | |
| 9 | 2006 | 4 |
About E. Pek
E. Pek is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Infectious Diseases, Organic Chemistry and Surgery, having authored 9 papers that have together received 640 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (9 papers), Electronic Packaging and Soldering Technologies (9 papers), Electrostatic Discharge in Electronics (7 papers) and Material Properties and Processing (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (602 citations), Mechanics of Materials (229 citations), Mechanical Engineering (97 citations), Civil and Structural Engineering (39 citations) and Hardware and Architecture (12 citations). E. Pek has collaborated with scholars based in Singapore, Switzerland and United States. Frequent co-authors include Tong Yan Tee, Chwee Teck Lim, Z.W. Zhong, Jing-en Luan, Hun Shen Ng, Jiang Zhou and V.B.C. Tan. Their work appears in journals such as Microelectronics Reliability and IEEE Transactions on Components and Packaging Technologies.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.