Soldering and Surface Mount Technology

8.6k citations
827 papers · · active since 1950

Impact in

Papers in

Soldering and Surface Mount Technology

764 papers receiving 8.1k citations

Peers

Soldering and Surface Mount Technology
Comparison fields: 5 of 123
  • General Materials Science 469
  • Electrical and Electronic Engineering 7.4k
  • Mechanical Engineering 4.3k
  • Mechanics of Materials 1.3k
  • Industrial and Manufacturing Engineering 499
Replace Nanotechnology Reviews with:
Nanotechnology Reviews China
Metal Finishing United States
IEEE Transactions on Components and Packaging Technologies United States
IEEE Transactions on Advanced Packaging United States
Archives of Materials Science and Engineering Poland
International Journal of Materials and Product Technology China
Circuit World United States
Advances in Materials and Processing Technologies India
Carbon letters South Korea
Surface Engineering and Applied Electrochemistry Russia
Soldering and Surface Mount Technology relative to Nanotechnology Reviews China Nanotechnology Reviews's profile →
Citations per field
00.5×7.8×
Nanotechnology Reviews · 1×
Citations per year

Countries where authors publish in Soldering and Surface Mount Technology

Since Specialization
Citations

This map shows the geographic impact of research published in Soldering and Surface Mount Technology. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by papers published in Soldering and Surface Mount Technology with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Soldering and Surface Mount Technology more than expected).

Fields of papers published in Soldering and Surface Mount Technology

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers published in Soldering and Surface Mount Technology. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers published in Soldering and Surface Mount Technology.

About Soldering and Surface Mount Technology

The 827 papers published in Soldering and Surface Mount Technology in the last decades have received a total of 8.6k indexed citations . Papers published in Soldering and Surface Mount Technology usually cover General Materials Science (43 papers), Electrical and Electronic Engineering (731 papers), Mechanical Engineering (384 papers), Industrial and Manufacturing Engineering (60 papers) and Mechanics of Materials (121 papers) specifically the topics of Electronic Packaging and Soldering Technologies (688 papers), 3D IC and TSV technologies (373 papers), Advanced Welding Techniques Analysis (119 papers), Aluminum Alloys Composites Properties (98 papers), Intermetallics and Advanced Alloy Properties (97 papers), Integrated Circuits and Semiconductor Failure Analysis (52 papers), Aluminum Alloy Microstructure Properties (45 papers) and Metallurgical and Alloy Processes (39 papers). The most active scholars publishing in Soldering and Surface Mount Technology are Bob Willis, Paul G. Harris, C. H. Lea, W. J. Plumbridge, Johan Liu, Olivér Krammer, Aytaç Altan, Z.W. Zhong, W. Engelmaier and Dongkai Shangguan.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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