Wei-Lan Chiu
Impact in
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
-
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Semiconductor materials and devices
Papers in
-
- Electronic Packaging and Soldering Technologies 34
- 3D IC and TSV technologies 33
-
- Copper Interconnects and Reliability 17
- Co-authors
- Hsiang‐Hung Chang (17 shared papers)Chih Chen (28 shared papers)Chia-Wen Chiang (7 shared papers)Dinh-Phuc Tran (13 shared papers)Shih‐Chi Yang (9 shared papers)K. N. Tu (4 shared papers)Kai-Cheng Shie (1 shared paper)Ching‐I Huang (1 shared paper)
- Journals
- Applied Surface Science (6 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)Journal of Materials Research and Technology (2 papers)Scientific Reports (1 paper)Surfaces and Interfaces (1 paper)
- Partner nations
- TaiwanUnited StatesNorway
In The Last Decade
Wei-Lan Chiu
38 papers receiving 280 citations
Peers
Comparison fields: 5 of 23
- Automotive Engineering 57
- Electrical and Electronic Engineering 246
- Electronic, Optical and Magnetic Materials 74
- Ceramics and Composites 16
- Industrial and Manufacturing Engineering 23
Countries citing papers authored by Wei-Lan Chiu
This map shows the geographic impact of Wei-Lan Chiu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wei-Lan Chiu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wei-Lan Chiu more than expected).
Fields of papers citing papers by Wei-Lan Chiu
This network shows the impact of papers produced by Wei-Lan Chiu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wei-Lan Chiu. The network helps show where Wei-Lan Chiu may publish in the future.
Co-authors
The 25 scholars most cited alongside Wei-Lan Chiu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 43 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2022 | 50 | |
| 2 | 2021 | 29 | |
| 3 | 2023 | 20 | |
| 4 | 2020 | 19 | |
| 5 | 2022 | 18 | |
| 6 | 2023 | 15 | |
| 7 | 2024 | 14 | |
| 8 | 2023 | 14 | |
| 9 | 2022 | 11 | |
| 10 | 2024 | 10 | |
| 11 | 2024 | 9 | |
| 12 | 2023 | 7 | |
| 13 | 2023 | 7 | |
| 14 | 2023 | 7 | |
| 15 | 2022 | 7 | |
| 16 | 2024 | 7 | |
| 17 | 2023 | 6 | |
| 18 | 2021 | 5 | |
| 19 | 2024 | 4 | |
| 20 | 2023 | 4 |
About Wei-Lan Chiu
Wei-Lan Chiu is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering, Mechanics of Materials and Mechanical Engineering, having authored 43 papers that have together received 290 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (34 papers), 3D IC and TSV technologies (33 papers), Copper Interconnects and Reliability (17 papers), Metal and Thin Film Mechanics (5 papers), Nanofabrication and Lithography Techniques (4 papers), Aluminum Alloys Composites Properties (4 papers), Advanced Surface Polishing Techniques (3 papers) and Additive Manufacturing and 3D Printing Technologies (3 papers). The work is most often cited by research in Automotive Engineering (57 citations), Electrical and Electronic Engineering (246 citations), Electronic, Optical and Magnetic Materials (74 citations), Ceramics and Composites (16 citations) and Industrial and Manufacturing Engineering (23 citations). Wei-Lan Chiu has collaborated with scholars based in Taiwan, United States and Norway. Frequent co-authors include Hsiang‐Hung Chang, Chih Chen, Chia-Wen Chiang, Dinh-Phuc Tran, Shih‐Chi Yang, K. N. Tu, Kai-Cheng Shie, Ching‐I Huang, Chia‐Hsin Lee and Yuan Chen. Their work appears in journals such as Applied Surface Science, IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of Materials Research and Technology, Scientific Reports and Surfaces and Interfaces.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.