Wei-Lan Chiu
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
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- Copper Interconnects and Reliability
Papers in
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- Copper Interconnects and Reliability 19
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- Electronic Packaging and Soldering Technologies 37
- 3D IC and TSV technologies 35
- Co-authors
- Chih Chen (31 shared papers)Hsiang‐Hung Chang (18 shared papers)Chien-Min Liu (3 shared papers)Dinh-Phuc Tran (13 shared papers)Chia-Wen Chiang (8 shared papers)Jia-Juen Ong (14 shared papers)Yi-Sa Huang (1 shared paper)Shih‐Chi Yang (9 shared papers)
- Journals
- Applied Surface Science (6 papers)Journal of Materials Research and Technology (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)Nanomaterials (1 paper)Scientific Reports (1 paper)
- Partner nations
- TaiwanUnited StatesHong Kong
In The Last Decade
Wei-Lan Chiu
45 papers receiving 515 citations
Peers
Comparison fields: 5 of 26
- Electrical and Electronic Engineering 418
- Electronic, Optical and Magnetic Materials 130
- Automotive Engineering 73
- Ceramics and Composites 23
- Mechanical Engineering 126
Countries citing papers authored by Wei-Lan Chiu
This map shows the geographic impact of Wei-Lan Chiu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wei-Lan Chiu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wei-Lan Chiu more than expected).
Fields of papers citing papers by Wei-Lan Chiu
This network shows the impact of papers produced by Wei-Lan Chiu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wei-Lan Chiu. The network helps show where Wei-Lan Chiu may publish in the future.
Co-authors
The 25 scholars most cited alongside Wei-Lan Chiu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 47 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2022 | 65 | |
| 2 | 2014 | 59 | |
| 3 | 2014 | 51 | |
| 4 | 2021 | 33 | |
| 5 | 2023 | 31 | |
| 6 | 2022 | 26 | |
| 7 | 2015 | 23 | |
| 8 | 2024 | 22 | |
| 9 | 2023 | 20 | |
| 10 | 2020 | 20 | |
| 11 | 2023 | 20 | |
| 12 | 2024 | 17 | |
| 13 | 2024 | 14 | |
| 14 | 2022 | 13 | |
| 15 | 2023 | 10 | |
| 16 | 2023 | 10 | |
| 17 | 2024 | 10 | |
| 18 | 2024 | 10 | |
| 19 | 2023 | 9 | |
| 20 | 2023 | 9 |
About Wei-Lan Chiu
Wei-Lan Chiu is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Mechanics of Materials, Ceramics and Composites and Mechanical Engineering, having authored 47 papers that have together received 544 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (37 papers), 3D IC and TSV technologies (35 papers), Copper Interconnects and Reliability (19 papers), Metal and Thin Film Mechanics (6 papers), Aluminum Alloys Composites Properties (5 papers), Nanofabrication and Lithography Techniques (4 papers), Advanced ceramic materials synthesis (3 papers) and Advanced Surface Polishing Techniques (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (418 citations), Electronic, Optical and Magnetic Materials (130 citations), Automotive Engineering (73 citations), Ceramics and Composites (23 citations) and Mechanical Engineering (126 citations). Wei-Lan Chiu has collaborated with scholars based in Taiwan, United States and Hong Kong. Frequent co-authors include Chih Chen, Hsiang‐Hung Chang, Chien-Min Liu, Dinh-Phuc Tran, Chia-Wen Chiang, Jia-Juen Ong, Yi-Sa Huang, Shih‐Chi Yang, K. N. Tu and Kai-Cheng Shie. Their work appears in journals such as Applied Surface Science, Journal of Materials Research and Technology, IEEE Transactions on Components Packaging and Manufacturing Technology, Nanomaterials and Scientific Reports.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.