Wei‐Chung Lo

35 papers and 695 indexed citations i.

Wei‐Chung Lo has authored 35 papers that have received a total of 695 indexed citations. This includes 29 papers in Electrical and Electronic Engineering, 5 papers in Automotive Engineering and 4 papers in Organic Chemistry. The topics of these papers are 3D IC and TSV technologies (15 papers), Electronic Packaging and Soldering Technologies (12 papers) and Ferroelectric and Negative Capacitance Devices (11 papers). Wei‐Chung Lo is often cited by papers focused on 3D IC and TSV technologies (15 papers), Electronic Packaging and Soldering Technologies (12 papers) and Ferroelectric and Negative Capacitance Devices (11 papers) and collaborates with scholars based in Taiwan, United States and Hong Kong. Wei‐Chung Lo's co-authors include Shyh-Shyuan Sheu, Tuo‐Hung Hou, Jian-Wei Su, Chih‐I Wu and Shie‐Ming Peng and has published in prestigious journals such as Chemical Communications, Inorganic Chemistry and Journal of Magnetism and Magnetic Materials.