Wenchao Tian
About
Wenchao Tian has authored 58 papers that have received a total of 1.1k indexed citations.
This includes 47 papers in Electrical and Electronic Engineering, 13 papers in Biomedical Engineering and 11 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (11 papers) and Advanced MEMS and NEMS Technologies (9 papers). Wenchao Tian is often cited by papers focused on Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (11 papers) and Advanced MEMS and NEMS Technologies (9 papers) and collaborates with scholars based in China, United States and Australia. Wenchao Tian's co-authors include Le Jiang, Zeyi Wu, Linfeng Hu, Yongkun Wang and Cailing Cai and has published in prestigious journals such as ACS Nano, Journal of Applied Physics and Advanced Energy Materials.
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