Johan Liu
Impact in
- Materials Chemistry top 1%
- Thermal properties of materials
- Graphene research and applications
- Carbon Nanotubes in Composites
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
Papers in
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- Thermal properties of materials 119
- Graphene research and applications 85
- Carbon Nanotubes in Composites 69
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- Electronic Packaging and Soldering Technologies 121
- 3D IC and TSV technologies 65
- Co-authors
- Lilei Ye (96 shared papers)Yifeng Fu (75 shared papers)Zonghe Lai (29 shared papers)Josef Hansson (13 shared papers)Torbjörn Nilsson (11 shared papers)Björn Carlberg (22 shared papers)Kjell Jeppson (26 shared papers)Yong Zhang (28 shared papers)
- Journals
- Journal of Electronic Materials (7 papers)Nanotechnology (7 papers)Journal of Electronic Packaging (6 papers)Carbon (5 papers)ACS Applied Materials & Interfaces (5 papers)
- Partner nations
- SwedenChinaUnited States
In The Last Decade
Johan Liu
364 papers receiving 6.8k citations
Peers
Comparison fields: 5 of 129
- Materials Chemistry 3.4k
- Electrical and Electronic Engineering 2.9k
- Biomedical Engineering 2.0k
- Polymers and Plastics 560
- Mechanical Engineering 1.4k
Countries citing papers authored by Johan Liu
This map shows the geographic impact of Johan Liu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Johan Liu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Johan Liu more than expected).
Fields of papers citing papers by Johan Liu
This network shows the impact of papers produced by Johan Liu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Johan Liu. The network helps show where Johan Liu may publish in the future.
Co-authors
The 25 scholars most cited alongside Johan Liu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 377 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2017 | 362 | |
| 2 | 2020 | 264 | |
| 3 | 2019 | 235 | |
| 4 | Conductive adhesives for electronics packaging | 1999 | 203 |
| 5 | 1999 | 159 | |
| 6 | 2018 | 150 | |
| 7 | 1996 | 142 | |
| 8 | 2015 | 139 | |
| 9 | 2016 | 136 | |
| 10 | 2015 | 127 | |
| 11 | 2002 | 116 | |
| 12 | 2013 | 100 | |
| 13 | 2009 | 98 | |
| 14 | 2013 | 96 | |
| 15 | 2017 | 95 | |
| 16 | 2017 | 90 | |
| 17 | 2012 | 71 | |
| 18 | 2016 | 71 | |
| 19 | 2016 | 67 | |
| 20 | 2020 | 67 |
About Johan Liu
Johan Liu is a scholar working on Materials Chemistry, Electrical and Electronic Engineering, Mechanical Engineering, Biomedical Engineering and Mechanics of Materials, having authored 377 papers that have together received 7.0k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (121 papers), Thermal properties of materials (119 papers), Graphene research and applications (85 papers), Carbon Nanotubes in Composites (69 papers), 3D IC and TSV technologies (65 papers), Heat Transfer and Optimization (41 papers), Advanced Sensor and Energy Harvesting Materials (37 papers) and Thermal Radiation and Cooling Technologies (31 papers). The work is most often cited by research in Materials Chemistry (3.4k citations), Electrical and Electronic Engineering (2.9k citations), Biomedical Engineering (2.0k citations), Polymers and Plastics (560 citations) and Mechanical Engineering (1.4k citations). Johan Liu has collaborated with scholars based in Sweden, China and United States. Frequent co-authors include Lilei Ye, Yifeng Fu, Zonghe Lai, Josef Hansson, Torbjörn Nilsson, Björn Carlberg, Kjell Jeppson, Yong Zhang, Carl Zandén and Teng Wang. Their work appears in journals such as Journal of Electronic Materials, Nanotechnology, Journal of Electronic Packaging, Carbon and ACS Applied Materials & Interfaces.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.