Fei Qin
Impact in
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Advanced MIMO Systems Optimization
- Silicon Carbide Semiconductor Technologies
- Mechanical Engineering top 2%
- Advanced machining processes and optimization
- Aluminum Alloys Composites Properties
Papers in
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- Electronic Packaging and Soldering Technologies 86
- 3D IC and TSV technologies 54
- Silicon Carbide Semiconductor Technologies 25
- Integrated Circuits and Semiconductor Failure Analysis 19
-
- Aluminum Alloys Composites Properties 21
- Co-authors
- Tong An (80 shared papers)Pei Chen (64 shared papers)Yanwei Dai (71 shared papers)Shanzhi Chen (2 shared papers)Bo Hu (1 shared paper)Xi Li (1 shared paper)Tao Ding (2 shared papers)Jianzhuang Xiao (1 shared paper)
- Journals
- Microelectronics Reliability (8 papers)Journal of Electronic Packaging (7 papers)Engineering Fracture Mechanics (6 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (5 papers)Theoretical and Applied Fracture Mechanics (5 papers)
- Partner nations
- ChinaUnited StatesUnited Kingdom
In The Last Decade
Fei Qin
213 papers receiving 2.7k citations
Peers
Comparison fields: 5 of 114
- Electrical and Electronic Engineering 1.4k
- Mechanical Engineering 777
- Mechanics of Materials 485
- Automotive Engineering 199
- Building and Construction 208
Countries citing papers authored by Fei Qin
This map shows the geographic impact of Fei Qin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fei Qin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fei Qin more than expected).
Fields of papers citing papers by Fei Qin
This network shows the impact of papers produced by Fei Qin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fei Qin. The network helps show where Fei Qin may publish in the future.
Co-authors
The 25 scholars most cited alongside Fei Qin, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 234 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2016 | 276 | |
| 2 | 2020 | 147 | |
| 3 | 2008 | 142 | |
| 4 | 2014 | 91 | |
| 5 | 2016 | 90 | |
| 6 | 2019 | 66 | |
| 7 | 2017 | 46 | |
| 8 | 2016 | 42 | |
| 9 | 2017 | 42 | |
| 10 | 2009 | 41 | |
| 11 | 2016 | 41 | |
| 12 | 2022 | 39 | |
| 13 | 2020 | 37 | |
| 14 | 2019 | 35 | |
| 15 | 2012 | 34 | |
| 16 | 2018 | 31 | |
| 17 | 2019 | 31 | |
| 18 | 2019 | 29 | |
| 19 | 2020 | 28 | |
| 20 | 2019 | 28 |
About Fei Qin
Fei Qin is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Biomedical Engineering and Materials Chemistry, having authored 234 papers that have together received 2.7k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (86 papers), 3D IC and TSV technologies (54 papers), Advanced Surface Polishing Techniques (34 papers), Silicon Carbide Semiconductor Technologies (25 papers), Aluminum Alloys Composites Properties (21 papers), Fatigue and fracture mechanics (19 papers), Integrated Circuits and Semiconductor Failure Analysis (19 papers) and Numerical methods in engineering (18 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.4k citations), Mechanical Engineering (777 citations), Mechanics of Materials (485 citations), Automotive Engineering (199 citations) and Building and Construction (208 citations). Fei Qin has collaborated with scholars based in China, United States and United Kingdom. Frequent co-authors include Tong An, Pei Chen, Yanwei Dai, Shanzhi Chen, Bo Hu, Xi Li, Tao Ding, Jianzhuang Xiao, Zhenhua Duan and Yanpeng Gong. Their work appears in journals such as Microelectronics Reliability, Journal of Electronic Packaging, Engineering Fracture Mechanics, IEEE Transactions on Components Packaging and Manufacturing Technology and Theoretical and Applied Fracture Mechanics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.