R.N. Master
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Integrated Circuits and Semiconductor Failure Analysis
- Electrostatic Discharge in Electronics
- Silicon Carbide Semiconductor Technologies
Papers in
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- Electronic Packaging and Soldering Technologies 31
- 3D IC and TSV technologies 26
- Electromagnetic Compatibility and Noise Suppression 7
- Electrostatic Discharge in Electronics 5
- Integrated Circuits and Semiconductor Failure Analysis 4
- Silicon and Solar Cell Technologies 3
- Silicon Carbide Semiconductor Technologies 2
- Co-authors
- Madhavan Swaminathan (3 shared papers)Maxat N. Touzelbaev (2 shared papers)Richard C. Blish (4 shared papers)Jung-Hwan Choi (1 shared paper)Sumit Kumar Ray (3 shared papers)Mohammad Khan (2 shared papers)Rao Tummala (2 shared papers)Ching Ping Wong (2 shared papers)
- Journals
- IEEE Transactions on Electronics Packaging Manufacturing (2 papers)IEEE Transactions on Electromagnetic Compatibility (1 paper)IEEE Transactions on Device and Materials Reliability (1 paper)IBM Journal of Research and Development (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)
- Partner nations
- United StatesCanada
In The Last Decade
R.N. Master
39 papers receiving 398 citations
Peers
Comparison fields: 5 of 39
- Electrical and Electronic Engineering 371
- Ceramics and Composites 25
- Mechanics of Materials 64
- Hardware and Architecture 18
- Nuclear Energy and Engineering 1
Countries citing papers authored by R.N. Master
This map shows the geographic impact of R.N. Master's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by R.N. Master with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites R.N. Master more than expected).
Fields of papers citing papers by R.N. Master
This network shows the impact of papers produced by R.N. Master. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by R.N. Master. The network helps show where R.N. Master may publish in the future.
Co-authors
The 25 scholars most cited alongside R.N. Master, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 40 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2006 | 40 | |
| 2 | 2005 | 34 | |
| 3 | 2009 | 34 | |
| 4 | 1992 | 31 | |
| 5 | 2004 | 25 | |
| 6 | 2002 | 24 | |
| 7 | 2008 | 22 | |
| 8 | 2007 | 20 | |
| 9 | 2003 | 18 | |
| 10 | 2012 | 18 | |
| 11 | 1992 | 15 | |
| 12 | 2002 | 14 | |
| 13 | 2008 | 11 | |
| 14 | 1991 | 11 | |
| 15 | 2007 | 10 | |
| 16 | 2010 | 10 | |
| 17 | 2007 | 8 | |
| 18 | 2009 | 8 | |
| 19 | 2002 | 8 | |
| 20 | 2003 | 6 |
About R.N. Master
R.N. Master is a scholar working on Electrical and Electronic Engineering, Industrial and Manufacturing Engineering, Automotive Engineering, Mechanics of Materials and Surfaces, Coatings and Films, having authored 40 papers that have together received 421 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (26 papers), Electromagnetic Compatibility and Noise Suppression (7 papers), Electrostatic Discharge in Electronics (5 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers), Additive Manufacturing and 3D Printing Technologies (3 papers), Silicon and Solar Cell Technologies (3 papers) and Silicon Carbide Semiconductor Technologies (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (371 citations), Ceramics and Composites (25 citations), Mechanics of Materials (64 citations), Hardware and Architecture (18 citations) and Nuclear Energy and Engineering (1 citation). R.N. Master has collaborated with scholars based in United States and Canada. Frequent co-authors include Madhavan Swaminathan, Maxat N. Touzelbaev, Richard C. Blish, Jung-Hwan Choi, Sumit Kumar Ray, Mohammad Khan, Rao Tummala, Ching Ping Wong, Myung Jin Yim and Daniel F. Baldwin. Their work appears in journals such as IEEE Transactions on Electronics Packaging Manufacturing, IEEE Transactions on Electromagnetic Compatibility, IEEE Transactions on Device and Materials Reliability, IBM Journal of Research and Development and IEEE Transactions on Components Packaging and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.