Daniel F. Baldwin
About
Daniel F. Baldwin has authored 29 papers that have received a total of 1.8k indexed citations.
This includes 15 papers in Electrical and Electronic Engineering, 12 papers in Mechanical Engineering and 10 papers in Polymers and Plastics. The topics of these papers are Electronic Packaging and Soldering Technologies (13 papers), Polymer Foaming and Composites (9 papers) and 3D IC and TSV technologies (7 papers). Daniel F. Baldwin is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), Polymer Foaming and Composites (9 papers) and 3D IC and TSV technologies (7 papers) and collaborates with scholars based in United States, Canada and Norway. Daniel F. Baldwin's co-authors include Nam P. Suh, Chul B. Park, Sang-Il Lee, Myung Jin Yim and Sangil Lee and has published in prestigious journals such as Journal of Applied Physics, Biomaterials and Nanotechnology.
In The Last Decade
Fields of papers published by Daniel F. Baldwin
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by Daniel F. Baldwin
Since SpecializationCitations
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