Jeff Punch
Impact in
- Mechanical Engineering top 2%
- Heat Transfer and Optimization
- Heat Transfer and Boiling Studies
- Innovative Energy Harvesting Technologies
- Heat Transfer Mechanisms
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Energy Harvesting in Wireless Networks
Papers in
-
- Heat Transfer and Optimization 39
- Heat Transfer Mechanisms 23
- Innovative Energy Harvesting Technologies 22
- Heat Transfer and Boiling Studies 21
-
- Electronic Packaging and Soldering Technologies 36
- Energy Harvesting in Wireless Networks 19
- 3D IC and TSV technologies 19
- Wireless Power Transfer Systems 15
- Co-authors
- Vanessa Egan (20 shared papers)Maurice N. Collins (12 shared papers)Edmond J. Walsh (25 shared papers)Marc Mac Giolla Eain (6 shared papers)Nicholas Jeffers (21 shared papers)Eric Dalton (8 shared papers)Ronan Frizzell (15 shared papers)Mark Reid (12 shared papers)
- Journals
- Journal of Electronic Packaging (7 papers)International Journal of Heat and Mass Transfer (6 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (5 papers)Applied Thermal Engineering (4 papers)Journal of The Electrochemical Society (4 papers)
- Partner nations
- IrelandUnited StatesCanada
In The Last Decade
Jeff Punch
145 papers receiving 1.9k citations
Peers
Comparison fields: 5 of 82
- Mechanical Engineering 1.1k
- Electrical and Electronic Engineering 1.0k
- Computational Mechanics 306
- Surfaces, Coatings and Films 101
- Aerospace Engineering 259
Countries citing papers authored by Jeff Punch
This map shows the geographic impact of Jeff Punch's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jeff Punch with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jeff Punch more than expected).
Fields of papers citing papers by Jeff Punch
This network shows the impact of papers produced by Jeff Punch. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jeff Punch. The network helps show where Jeff Punch may publish in the future.
Co-authors
The 25 scholars most cited alongside Jeff Punch, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 153 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2015 | 116 | |
| 2 | 2013 | 91 | |
| 3 | 2008 | 79 | |
| 4 | 2010 | 73 | |
| 5 | 2018 | 70 | |
| 6 | 2008 | 69 | |
| 7 | 2009 | 59 | |
| 8 | 2016 | 59 | |
| 9 | 2021 | 54 | |
| 10 | 2009 | 49 | |
| 11 | 2000 | 48 | |
| 12 | 2012 | 44 | |
| 13 | 2010 | 41 | |
| 14 | 2011 | 40 | |
| 15 | 2011 | 38 | |
| 16 | 2014 | 35 | |
| 17 | 2013 | 34 | |
| 18 | 2009 | 31 | |
| 19 | 2003 | 28 | |
| 20 | 2016 | 27 |
About Jeff Punch
Jeff Punch is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering, Computational Mechanics, Aerospace Engineering and Biomedical Engineering, having authored 153 papers that have together received 2.0k indexed citations. Recurring topics across this work include Heat Transfer and Optimization (39 papers), Electronic Packaging and Soldering Technologies (36 papers), Heat Transfer Mechanisms (23 papers), Innovative Energy Harvesting Technologies (22 papers), Heat Transfer and Boiling Studies (21 papers), Energy Harvesting in Wireless Networks (19 papers), 3D IC and TSV technologies (19 papers) and Wireless Power Transfer Systems (15 papers). The work is most often cited by research in Mechanical Engineering (1.1k citations), Electrical and Electronic Engineering (1.0k citations), Computational Mechanics (306 citations), Surfaces, Coatings and Films (101 citations) and Aerospace Engineering (259 citations). Jeff Punch has collaborated with scholars based in Ireland, United States and Canada. Frequent co-authors include Vanessa Egan, Maurice N. Collins, Edmond J. Walsh, Marc Mac Giolla Eain, Nicholas Jeffers, Eric Dalton, Ronan Frizzell, Mark Reid, Thomas Breen and Cullen Bash. Their work appears in journals such as Journal of Electronic Packaging, International Journal of Heat and Mass Transfer, IEEE Transactions on Components Packaging and Manufacturing Technology, Applied Thermal Engineering and Journal of The Electrochemical Society.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.