Jeff Punch
Impact in
- Mechanical Engineering top 2%
- Heat Transfer and Optimization
- Heat Transfer and Boiling Studies
- Innovative Energy Harvesting Technologies
- Heat Transfer Mechanisms
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Energy Harvesting in Wireless Networks
Papers in
-
- Heat Transfer and Optimization 37
- Heat Transfer Mechanisms 23
- Heat Transfer and Boiling Studies 20
- Innovative Energy Harvesting Technologies 20
-
- Electronic Packaging and Soldering Technologies 33
- 3D IC and TSV technologies 19
- Energy Harvesting in Wireless Networks 17
- Co-authors
- Vanessa Egan (18 shared papers)Maurice N. Collins (10 shared papers)Marc Mac Giolla Eain (6 shared papers)Edmond J. Walsh (25 shared papers)Nicholas Jeffers (21 shared papers)Eric Dalton (6 shared papers)Mark Reid (12 shared papers)Ronan Frizzell (13 shared papers)
- Journals
- Journal of Electronic Packaging (7 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (5 papers)International Journal of Heat and Mass Transfer (5 papers)Applied Thermal Engineering (4 papers)Journal of The Electrochemical Society (4 papers)
- Partner nations
- IrelandUnited StatesUnited Kingdom
In The Last Decade
Jeff Punch
137 papers receiving 1.8k citations
Peers
Comparison fields: 5 of 82
- Mechanical Engineering 1.1k
- Electrical and Electronic Engineering 948
- Computational Mechanics 296
- Surfaces, Coatings and Films 96
- Aerospace Engineering 244
Countries citing papers authored by Jeff Punch
This map shows the geographic impact of Jeff Punch's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jeff Punch with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jeff Punch more than expected).
Fields of papers citing papers by Jeff Punch
This network shows the impact of papers produced by Jeff Punch. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jeff Punch. The network helps show where Jeff Punch may publish in the future.
Co-authors
The 25 scholars most cited alongside Jeff Punch, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 143 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2015 | 111 | |
| 2 | 2013 | 89 | |
| 3 | 2008 | 76 | |
| 4 | 2008 | 67 | |
| 5 | 2010 | 65 | |
| 6 | 2018 | 65 | |
| 7 | 2016 | 55 | |
| 8 | 2009 | 54 | |
| 9 | 2021 | 52 | |
| 10 | 2009 | 49 | |
| 11 | 2000 | 48 | |
| 12 | 2012 | 40 | |
| 13 | 2011 | 39 | |
| 14 | 2010 | 38 | |
| 15 | 2011 | 35 | |
| 16 | 2014 | 35 | |
| 17 | 2013 | 32 | |
| 18 | 2009 | 28 | |
| 19 | 2003 | 27 | |
| 20 | 2005 | 26 |
About Jeff Punch
Jeff Punch is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering, Computational Mechanics, Aerospace Engineering and Biomedical Engineering, having authored 143 papers that have together received 1.8k indexed citations. Recurring topics across this work include Heat Transfer and Optimization (37 papers), Electronic Packaging and Soldering Technologies (33 papers), Heat Transfer Mechanisms (23 papers), Heat Transfer and Boiling Studies (20 papers), Innovative Energy Harvesting Technologies (20 papers), 3D IC and TSV technologies (19 papers), Energy Harvesting in Wireless Networks (17 papers) and Fluid Dynamics and Turbulent Flows (14 papers). The work is most often cited by research in Mechanical Engineering (1.1k citations), Electrical and Electronic Engineering (948 citations), Computational Mechanics (296 citations), Surfaces, Coatings and Films (96 citations) and Aerospace Engineering (244 citations). Jeff Punch has collaborated with scholars based in Ireland, United States and United Kingdom. Frequent co-authors include Vanessa Egan, Maurice N. Collins, Marc Mac Giolla Eain, Edmond J. Walsh, Nicholas Jeffers, Eric Dalton, Mark Reid, Ronan Frizzell, Thomas Breen and Cullen Bash. Their work appears in journals such as Journal of Electronic Packaging, IEEE Transactions on Components Packaging and Manufacturing Technology, International Journal of Heat and Mass Transfer, Applied Thermal Engineering and Journal of The Electrochemical Society.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.