C. Bailey
Impact in
-
- Electronic Packaging and Soldering Technologies
- Silicon Carbide Semiconductor Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Mechanical Engineering top 1%
Papers in
-
- Electronic Packaging and Soldering Technologies 165
- 3D IC and TSV technologies 84
- Silicon Carbide Semiconductor Technologies 56
- Electromagnetic Compatibility and Noise Suppression 28
- Integrated Circuits and Semiconductor Failure Analysis 20
- Co-authors
- Hua Lu (101 shared papers)M. Cross (27 shared papers)Chunyan Yin (47 shared papers)Stoyan Stoyanov (100 shared papers)M.J. Rizvi (16 shared papers)C. Mark Johnson (18 shared papers)K. Pericleous (26 shared papers)T. Tilford (50 shared papers)
- Journals
- Microelectronics Reliability (20 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (7 papers)Applied Mathematical Modelling (6 papers)IEEE Access (5 papers)IEEE Transactions on Components and Packaging Technologies (3 papers)
- Partner nations
- United KingdomUnited StatesHong Kong
In The Last Decade
C. Bailey
382 papers receiving 4.4k citations
Peers
Comparison fields: 5 of 147
- Electrical and Electronic Engineering 2.5k
- Mechanical Engineering 1.2k
- Computational Mechanics 593
- Mechanics of Materials 693
- Automotive Engineering 289
Countries citing papers authored by C. Bailey
This map shows the geographic impact of C. Bailey's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. Bailey with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. Bailey more than expected).
Fields of papers citing papers by C. Bailey
This network shows the impact of papers produced by C. Bailey. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. Bailey. The network helps show where C. Bailey may publish in the future.
Co-authors
The 25 scholars most cited alongside C. Bailey, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 417 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2009 | 156 | |
| 2 | 2017 | 142 | |
| 3 | 2014 | 135 | |
| 4 | 2004 | 109 | |
| 5 | 1995 | 103 | |
| 6 | 2015 | 86 | |
| 7 | 2005 | 78 | |
| 8 | 2002 | 77 | |
| 9 | 1991 | 76 | |
| 10 | 2008 | 72 | |
| 11 | 2000 | 69 | |
| 12 | 2002 | 67 | |
| 13 | 2009 | 65 | |
| 14 | 1995 | 64 | |
| 15 | 2002 | 64 | |
| 16 | 2002 | 59 | |
| 17 | 2006 | 57 | |
| 18 | 2006 | 57 | |
| 19 | 2022 | 50 | |
| 20 | 2003 | 48 |
About C. Bailey
C. Bailey is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Computational Mechanics and Biomedical Engineering, having authored 417 papers that have together received 4.6k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (165 papers), 3D IC and TSV technologies (84 papers), Silicon Carbide Semiconductor Technologies (56 papers), Electromagnetic Compatibility and Noise Suppression (28 papers), Integrated Circuits and Semiconductor Failure Analysis (20 papers), Metallurgy and Material Forming (20 papers), Additive Manufacturing and 3D Printing Technologies (16 papers) and Probabilistic and Robust Engineering Design (16 papers). The work is most often cited by research in Electrical and Electronic Engineering (2.5k citations), Mechanical Engineering (1.2k citations), Computational Mechanics (593 citations), Mechanics of Materials (693 citations) and Automotive Engineering (289 citations). C. Bailey has collaborated with scholars based in United Kingdom, United States and Hong Kong. Frequent co-authors include Hua Lu, M. Cross, Chunyan Yin, Stoyan Stoyanov, M.J. Rizvi, C. Mark Johnson, K. Pericleous, T. Tilford, Gareth Taylor and Mahera Musallam. Their work appears in journals such as Microelectronics Reliability, IEEE Transactions on Components Packaging and Manufacturing Technology, Applied Mathematical Modelling, IEEE Access and IEEE Transactions on Components and Packaging Technologies.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.