Jingwei Xian

33 papers and 755 indexed citations i.

Jingwei Xian has authored 33 papers that have received a total of 755 indexed citations. This includes 24 papers in Electrical and Electronic Engineering, 24 papers in Mechanical Engineering and 19 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (24 papers), Aluminum Alloy Microstructure Properties (19 papers) and Aluminum Alloys Composites Properties (12 papers). Jingwei Xian is often cited by papers focused on Electronic Packaging and Soldering Technologies (24 papers), Aluminum Alloy Microstructure Properties (19 papers) and Aluminum Alloys Composites Properties (12 papers) and collaborates with scholars based in United Kingdom, Japan and China. Jingwei Xian's co-authors include C.M. Gourlay, S. Belyakov, Guang Zeng, Hideyuki Yasuda and Fionn P.E. Dunne and has published in prestigious journals such as Nature Communications, Acta Materialia and Scientific Reports.