John Osenbach
Impact in
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- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- 3D IC and TSV technologies
- Thin-Film Transistor Technologies
- Semiconductor Lasers and Optical Devices
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
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- Electronic Packaging and Soldering Technologies 27
- Semiconductor materials and devices 22
- 3D IC and TSV technologies 16
- Semiconductor Lasers and Optical Devices 14
- Thin-Film Transistor Technologies 11
- Integrated Circuits and Semiconductor Failure Analysis 9
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- Advanced Welding Techniques Analysis 7
- Co-authors
- W. R. Knolle (8 shared papers)J. M. DeLucca (8 shared papers)V. S. STUBIČAN (4 shared papers)F. A. Baiocchi (7 shared papers)R. B. Comizzoli (13 shared papers)Navin Chand (5 shared papers)Jongwoo Park (3 shared papers)C. D. Theis (7 shared papers)
- Journals
- Journal of Applied Physics (7 papers)Journal of The Electrochemical Society (6 papers)IEEE Transactions on Electronics Packaging Manufacturing (4 papers)Journal of Lightwave Technology (3 papers)Journal of Electronic Materials (3 papers)
- Partner nations
- United StatesSingaporeSouth Korea
In The Last Decade
John Osenbach
67 papers receiving 836 citations
Peers
Comparison fields: 5 of 58
- Electrical and Electronic Engineering 794
- Ceramics and Composites 36
- Materials Chemistry 249
- Electronic, Optical and Magnetic Materials 94
- General Materials Science 16
Countries citing papers authored by John Osenbach
This map shows the geographic impact of John Osenbach's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by John Osenbach with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites John Osenbach more than expected).
Fields of papers citing papers by John Osenbach
This network shows the impact of papers produced by John Osenbach. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by John Osenbach. The network helps show where John Osenbach may publish in the future.
Co-authors
The 25 scholars most cited alongside John Osenbach, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 74 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1985 | 77 | |
| 2 | 2007 | 66 | |
| 3 | 1996 | 52 | |
| 4 | 2006 | 50 | |
| 5 | 2005 | 50 | |
| 6 | 1996 | 38 | |
| 7 | 2011 | 38 | |
| 8 | 1988 | 37 | |
| 9 | 1993 | 32 | |
| 10 | 1986 | 30 | |
| 11 | 1984 | 28 | |
| 12 | 1983 | 27 | |
| 13 | 1992 | 26 | |
| 14 | 2002 | 22 | |
| 15 | 1990 | 20 | |
| 16 | 1997 | 19 | |
| 17 | 1990 | 18 | |
| 18 | 1988 | 18 | |
| 19 | 1990 | 17 | |
| 20 | 2010 | 17 |
About John Osenbach
John Osenbach is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Materials Chemistry, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics, having authored 74 papers that have together received 951 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (27 papers), Semiconductor materials and devices (22 papers), 3D IC and TSV technologies (16 papers), Semiconductor Lasers and Optical Devices (14 papers), Thin-Film Transistor Technologies (11 papers), Integrated Circuits and Semiconductor Failure Analysis (9 papers), Aluminum Alloy Microstructure Properties (8 papers) and Advanced Welding Techniques Analysis (7 papers). The work is most often cited by research in Electrical and Electronic Engineering (794 citations), Ceramics and Composites (36 citations), Materials Chemistry (249 citations), Electronic, Optical and Magnetic Materials (94 citations) and General Materials Science (16 citations). John Osenbach has collaborated with scholars based in United States, Singapore and South Korea. Frequent co-authors include W. R. Knolle, J. M. DeLucca, V. S. STUBIČAN, F. A. Baiocchi, R. B. Comizzoli, Navin Chand, Jongwoo Park, C. D. Theis, G.A. Henshall and A. Elia. Their work appears in journals such as Journal of Applied Physics, Journal of The Electrochemical Society, IEEE Transactions on Electronics Packaging Manufacturing, Journal of Lightwave Technology and Journal of Electronic Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.