M. Mayer
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Advanced MEMS and NEMS Technologies
- Mechanical Engineering top 5%
- Advanced Welding Techniques Analysis
- Metal Forming Simulation Techniques
Papers in
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- Electronic Packaging and Soldering Technologies 102
- 3D IC and TSV technologies 14
- Advanced MEMS and NEMS Technologies 7
- Nanomaterials and Printing Technologies 2
-
- Advanced Welding Techniques Analysis 8
- Co-authors
- Y. Norman Zhou (50 shared papers)Chunqing Wang (6 shared papers)C.J. Hang (7 shared papers)Yanhong Tian (6 shared papers)J.T. Moon (17 shared papers)I. Lum (8 shared papers)Jae Pil Jung (13 shared papers)John Persic (21 shared papers)
- Journals
- Microelectronics Reliability (15 papers)Microelectronic Engineering (6 papers)MATERIALS TRANSACTIONS (5 papers)Journal of Electronic Materials (5 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (4 papers)
- Partner nations
- CanadaChinaSouth Korea
In The Last Decade
M. Mayer
115 papers receiving 1.6k citations
Peers
Comparison fields: 5 of 41
- Electrical and Electronic Engineering 1.4k
- Mechanical Engineering 282
- Mechanics of Materials 74
- General Materials Science 7
- Materials Chemistry 100
Countries citing papers authored by M. Mayer
This map shows the geographic impact of M. Mayer's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Mayer with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Mayer more than expected).
Fields of papers citing papers by M. Mayer
This network shows the impact of papers produced by M. Mayer. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Mayer. The network helps show where M. Mayer may publish in the future.
Co-authors
The 25 scholars most cited alongside M. Mayer, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 119 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2007 | 216 | |
| 2 | 2009 | 91 | |
| 3 | 2018 | 84 | |
| 4 | 2009 | 74 | |
| 5 | 2006 | 64 | |
| 6 | 2008 | 49 | |
| 7 | 2008 | 48 | |
| 8 | 1999 | 37 | |
| 9 | 2009 | 37 | |
| 10 | 2008 | 35 | |
| 11 | 2003 | 33 | |
| 12 | 2009 | 33 | |
| 13 | 2015 | 33 | |
| 14 | 2000 | 30 | |
| 15 | 2005 | 29 | |
| 16 | 2009 | 28 | |
| 17 | 2010 | 28 | |
| 18 | 2007 | 27 | |
| 19 | 2002 | 25 | |
| 20 | 2008 | 25 |
About M. Mayer
M. Mayer is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials and Ceramics and Composites, having authored 119 papers that have together received 1.7k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (102 papers), 3D IC and TSV technologies (14 papers), Advanced Welding Techniques Analysis (8 papers), Advanced MEMS and NEMS Technologies (7 papers), Ultrasonics and Acoustic Wave Propagation (3 papers), Copper Interconnects and Reliability (2 papers), Nanomaterials and Printing Technologies (2 papers) and Microstructure and mechanical properties (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.4k citations), Mechanical Engineering (282 citations), Mechanics of Materials (74 citations), General Materials Science (7 citations) and Materials Chemistry (100 citations). M. Mayer has collaborated with scholars based in Canada, China and South Korea. Frequent co-authors include Y. Norman Zhou, Chunqing Wang, C.J. Hang, Yanhong Tian, J.T. Moon, I. Lum, Jae Pil Jung, John Persic, H. Baltes and Di Erick Xu. Their work appears in journals such as Microelectronics Reliability, Microelectronic Engineering, MATERIALS TRANSACTIONS, Journal of Electronic Materials and IEEE Transactions on Components Packaging and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.