C.J. Hang
Impact in
- Mechanical Engineering top 10%
- Advanced Welding Techniques Analysis
- Aluminum Alloys Composites Properties
- Metal Forming Simulation Techniques
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
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- Electronic Packaging and Soldering Technologies 8
- 3D IC and TSV technologies 5
- Electrostatic Discharge in Electronics 2
- Integrated Circuits and Semiconductor Failure Analysis 2
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- Metal Forming Simulation Techniques 1
- Surface Treatment and Residual Stress 1
- Co-authors
- M. Mayer (7 shared papers)Y. Zhou (7 shared papers)Chunqing Wang (6 shared papers)Yanhong Tian (2 shared papers)I. Lum (4 shared papers)John Persic (2 shared papers)J.T. Moon (2 shared papers)Gaoxiang Ouyang (1 shared paper)
In The Last Decade
C.J. Hang
9 papers receiving 347 citations
Peers
Comparison fields: 5 of 30
- Mechanical Engineering 223
- Electrical and Electronic Engineering 280
- Electronic, Optical and Magnetic Materials 56
- Aerospace Engineering 69
- Mechanics of Materials 49
Countries citing papers authored by C.J. Hang
This map shows the geographic impact of C.J. Hang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C.J. Hang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C.J. Hang more than expected).
Fields of papers citing papers by C.J. Hang
This network shows the impact of papers produced by C.J. Hang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C.J. Hang. The network helps show where C.J. Hang may publish in the future.
Co-authors
The 15 scholars most cited alongside C.J. Hang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2007 | 213 | |
| 2 | 2008 | 34 | |
| 3 | 2009 | 32 | |
| 4 | 2010 | 26 | |
| 5 | 2008 | 25 | |
| 6 | 2009 | 21 | |
| 7 | 2009 | 13 | |
| 8 | 2024 | 11 | |
| 9 | 2007 | 6 |
About C.J. Hang
C.J. Hang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Electronic, Optical and Magnetic Materials and Biomaterials, having authored 9 papers that have together received 381 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (5 papers), Mechanical Behavior of Composites (2 papers), Electrostatic Discharge in Electronics (2 papers), Integrated Circuits and Semiconductor Failure Analysis (2 papers), Metal Forming Simulation Techniques (1 paper), Surface Treatment and Residual Stress (1 paper) and Copper Interconnects and Reliability (1 paper). The work is most often cited by research in Mechanical Engineering (223 citations), Electrical and Electronic Engineering (280 citations), Electronic, Optical and Magnetic Materials (56 citations), Aerospace Engineering (69 citations) and Mechanics of Materials (49 citations). C.J. Hang has collaborated with scholars based in China, Canada and Qatar. Frequent co-authors include M. Mayer, Y. Zhou, Chunqing Wang, Yanhong Tian, I. Lum, John Persic, J.T. Moon, Gaoxiang Ouyang, Dongdong Yang and Sangmoon Lee. Their work appears in journals such as Microelectronic Engineering, Microelectronics Reliability, Journal of Electronic Materials, Advanced Materials and Journal of Materials Science Materials in Electronics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.