John Persic
Impact in
- Mechanics of Materials top 10%
- Energetic Materials and Combustion
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
-
- Electronic Packaging and Soldering Technologies 25
- 3D IC and TSV technologies 12
- Electrostatic Discharge in Electronics 5
- Integrated Circuits and Semiconductor Failure Analysis 3
-
- Energetic Materials and Combustion 4
- Adhesion, Friction, and Surface Interactions 4
- Co-authors
- Y. Zhou (17 shared papers)Anming Hu (6 shared papers)M. Mayer (21 shared papers)John Z. Wen (4 shared papers)J.T. Moon (6 shared papers)Robert Liang (2 shared papers)Ngoc Ha Nguyen (2 shared papers)Jeff Wang (1 shared paper)
In The Last Decade
John Persic
32 papers receiving 471 citations
Peers
Comparison fields: 5 of 45
- Mechanics of Materials 131
- Electrical and Electronic Engineering 290
- Mechanical Engineering 143
- Electrochemistry 22
- Materials Chemistry 159
Countries citing papers authored by John Persic
This map shows the geographic impact of John Persic's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by John Persic with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites John Persic more than expected).
Fields of papers citing papers by John Persic
This network shows the impact of papers produced by John Persic. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by John Persic. The network helps show where John Persic may publish in the future.
Co-authors
The 25 scholars most cited alongside John Persic, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 33 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2013 | 69 | |
| 2 | 2011 | 50 | |
| 3 | 2013 | 37 | |
| 4 | 2009 | 33 | |
| 5 | 2010 | 28 | |
| 6 | 2010 | 27 | |
| 7 | 2017 | 23 | |
| 8 | 2010 | 23 | |
| 9 | 2012 | 23 | |
| 10 | 2013 | 22 | |
| 11 | 2009 | 21 | |
| 12 | 2009 | 14 | |
| 13 | 2013 | 13 | |
| 14 | 2008 | 12 | |
| 15 | 2010 | 11 | |
| 16 | 2020 | 9 | |
| 17 | 2009 | 9 | |
| 18 | 2009 | 8 | |
| 19 | 2023 | 7 | |
| 20 | 2013 | 7 |
About John Persic
John Persic is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Materials Chemistry and Electronic, Optical and Magnetic Materials, having authored 33 papers that have together received 486 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (25 papers), 3D IC and TSV technologies (12 papers), Electrostatic Discharge in Electronics (5 papers), Energetic Materials and Combustion (4 papers), Advanced Welding Techniques Analysis (4 papers), Adhesion, Friction, and Surface Interactions (4 papers), Metal Forming Simulation Techniques (3 papers) and Integrated Circuits and Semiconductor Failure Analysis (3 papers). The work is most often cited by research in Mechanics of Materials (131 citations), Electrical and Electronic Engineering (290 citations), Mechanical Engineering (143 citations), Electrochemistry (22 citations) and Materials Chemistry (159 citations). John Persic has collaborated with scholars based in Canada, China and Vietnam. Frequent co-authors include Y. Zhou, Anming Hu, M. Mayer, John Z. Wen, J.T. Moon, Robert Liang, Ngoc Ha Nguyen, Jeff Wang, C.J. Hang and Sophie Ringuette. Their work appears in journals such as Microelectronics Reliability, Journal of Materials Science Materials in Electronics, Microelectronic Engineering, Journal of Electronic Packaging and Nano-Micro Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.