M. C. Shine
Impact in
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- Copper Interconnects and Reliability
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- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- 3D IC and TSV technologies
Papers in
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- Electronic Packaging and Soldering Technologies 6
- Semiconductor materials and devices 1
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- Aluminum Alloys Composites Properties 4
- Intermetallics and Advanced Alloy Properties 3
- Co-authors
- F. M. d’Heurle (2 shared papers)J. W. Morris (3 shared papers)Z. Mei (3 shared papers)N. G. Ainslie (1 shared paper)A. Gangulee (1 shared paper)D. Grivas (1 shared paper)S. R. Herd (1 shared paper)R.K. MacCrone (1 shared paper)
- Journals
- Journal of Electronic Materials (2 papers)Applied Physics Letters (1 paper)Solid-State Electronics (1 paper)IBM Journal of Research and Development (1 paper)Journal of Electronic Packaging (1 paper)
- Partner nations
- United StatesGermany
In The Last Decade
M. C. Shine
9 papers receiving 258 citations
Peers
Comparison fields: 5 of 25
- Electronic, Optical and Magnetic Materials 94
- Electrical and Electronic Engineering 239
- Mechanical Engineering 137
- General Materials Science 8
- Mechanics of Materials 56
Countries citing papers authored by M. C. Shine
This map shows the geographic impact of M. C. Shine's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. C. Shine with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. C. Shine more than expected).
Fields of papers citing papers by M. C. Shine
This network shows the impact of papers produced by M. C. Shine. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. C. Shine. The network helps show where M. C. Shine may publish in the future.
Co-authors
The 8 scholars most cited alongside M. C. Shine, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 1991 | 67 | |
| 2 | 1972 | 61 | |
| 3 | 1971 | 36 | |
| 4 | 1990 | 34 | |
| 5 | 1985 | 29 | |
| 6 | 1991 | 18 | |
| 7 | 1972 | 17 | |
| 8 | 1968 | 9 | |
| 9 | 1975 | 3 |
About M. C. Shine
M. C. Shine is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Materials Chemistry, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics, having authored 9 papers that have together received 274 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (6 papers), Aluminum Alloys Composites Properties (4 papers), Copper Interconnects and Reliability (3 papers), Intermetallics and Advanced Alloy Properties (3 papers), Anodic Oxide Films and Nanostructures (2 papers), Surface and Thin Film Phenomena (2 papers), Semiconductor materials and interfaces (1 paper) and Semiconductor materials and devices (1 paper). The work is most often cited by research in Electronic, Optical and Magnetic Materials (94 citations), Electrical and Electronic Engineering (239 citations), Mechanical Engineering (137 citations), General Materials Science (8 citations) and Mechanics of Materials (56 citations). M. C. Shine has collaborated with scholars based in United States and Germany. Frequent co-authors include F. M. d’Heurle, J. W. Morris, Z. Mei, N. G. Ainslie, A. Gangulee, D. Grivas, S. R. Herd and R.K. MacCrone. Their work appears in journals such as Journal of Electronic Materials, Applied Physics Letters, Solid-State Electronics, IBM Journal of Research and Development and Journal of Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.