D. Grivas
Impact in
- General Materials Science top 2%
- Mechanical Engineering top 5%
- Advanced Welding Techniques Analysis
- Intermetallics and Advanced Alloy Properties
- Aluminum Alloys Composites Properties
Papers in
-
- Electronic Packaging and Soldering Technologies 13
- 3D IC and TSV technologies 8
-
- Advanced Welding Techniques Analysis 8
- Aluminum Alloys Composites Properties 2
- Co-authors
- J. W. Morris (12 shared papers)D. R. Frear (11 shared papers)K.L. Murty (1 shared paper)J.W. Morris (3 shared papers)M. C. Shine (1 shared paper)Z. Mei (1 shared paper)Terence G. Langdon (1 shared paper)M. McCormack (2 shared papers)
- Journals
- Journal of Electronic Materials (7 papers)Journal of Electronic Packaging (1 paper)JOM (1 paper)Soldering and Surface Mount Technology (1 paper)Acta Metallurgica (1 paper)
- Partner nations
- United StatesGermany
In The Last Decade
D. Grivas
15 papers receiving 601 citations
Peers
Comparison fields: 5 of 28
- General Materials Science 44
- Mechanical Engineering 461
- Electrical and Electronic Engineering 558
- Mechanics of Materials 143
- Aerospace Engineering 109
Countries citing papers authored by D. Grivas
This map shows the geographic impact of D. Grivas's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Grivas with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Grivas more than expected).
Fields of papers citing papers by D. Grivas
This network shows the impact of papers produced by D. Grivas. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Grivas. The network helps show where D. Grivas may publish in the future.
Co-authors
The 8 scholars most cited alongside D. Grivas, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 1988 | 113 | |
| 2 | 1987 | 82 | |
| 3 | 1979 | 72 | |
| 4 | 1987 | 68 | |
| 5 | 1986 | 53 | |
| 6 | 1989 | 49 | |
| 7 | 1989 | 43 | |
| 8 | 1988 | 38 | |
| 9 | 1990 | 34 | |
| 10 | 1981 | 25 | |
| 11 | Fatigue and thermal fatigue of Pb-Sn solder joints | 1987 | 12 |
| 12 | Fatigue and thermal fatigue testing of Pb-Sn solder joints | 1987 | 12 |
| 13 | 1986 | 12 | |
| 14 | 1988 | 10 | |
| 15 | 1989 | 9 |
About D. Grivas
D. Grivas is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Materials Chemistry and Aerospace Engineering, having authored 15 papers that have together received 632 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (8 papers), Advanced Welding Techniques Analysis (8 papers), Microstructure and mechanical properties (3 papers), Aluminum Alloy Microstructure Properties (2 papers), Metallurgy and Material Forming (2 papers), Aluminum Alloys Composites Properties (2 papers) and High-Velocity Impact and Material Behavior (1 paper). The work is most often cited by research in General Materials Science (44 citations), Mechanical Engineering (461 citations), Electrical and Electronic Engineering (558 citations), Mechanics of Materials (143 citations) and Aerospace Engineering (109 citations). D. Grivas has collaborated with scholars based in United States and Germany. Frequent co-authors include J. W. Morris, D. R. Frear, K.L. Murty, J.W. Morris, M. C. Shine, Z. Mei, Terence G. Langdon and M. McCormack. Their work appears in journals such as Journal of Electronic Materials, Journal of Electronic Packaging, JOM, Soldering and Surface Mount Technology and Acta Metallurgica.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.