Kai Esmark
Impact in
-
- Electrostatic Discharge in Electronics
- Integrated Circuits and Semiconductor Failure Analysis
- Semiconductor materials and devices
- Electromagnetic Compatibility and Noise Suppression
- Advancements in Semiconductor Devices and Circuit Design
- Silicon Carbide Semiconductor Technologies
- Thin-Film Transistor Technologies
- Hardware and Architecture top 10%
- Physical Unclonable Functions (PUFs) and Hardware Security
Papers in
-
- Electrostatic Discharge in Electronics 57
- Integrated Circuits and Semiconductor Failure Analysis 37
- Semiconductor materials and devices 36
- Electromagnetic Compatibility and Noise Suppression 17
- Advancements in Semiconductor Devices and Circuit Design 9
- Silicon Carbide Semiconductor Technologies 4
- 3D IC and TSV technologies 3
-
- High voltage insulation and dielectric phenomena 3
- Co-authors
- Wolfgang Stadler (27 shared papers)Harald Goßner (23 shared papers)D. Pogány (16 shared papers)E. Gornik (16 shared papers)M. Stecher (8 shared papers)Martin Litzenberger (11 shared papers)S. Bychikhin (5 shared papers)G. Groos (5 shared papers)
- Journals
- Microelectronics Reliability (15 papers)Journal of Electrostatics (2 papers)IEEE Transactions on Electron Devices (2 papers)IEEE Transactions on Device and Materials Reliability (2 papers)Advances in radio science (1 paper)
- Partner nations
- GermanyAustriaSwitzerland
In The Last Decade
Kai Esmark
58 papers receiving 546 citations
Peers
Comparison fields: 5 of 19
- Electrical and Electronic Engineering 572
- Hardware and Architecture 29
- Condensed Matter Physics 19
- Atomic and Molecular Physics, and Optics 12
- Materials Chemistry 15
Countries citing papers authored by Kai Esmark
This map shows the geographic impact of Kai Esmark's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kai Esmark with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kai Esmark more than expected).
Fields of papers citing papers by Kai Esmark
This network shows the impact of papers produced by Kai Esmark. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kai Esmark. The network helps show where Kai Esmark may publish in the future.
Co-authors
The 25 scholars most cited alongside Kai Esmark, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 58 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2002 | 48 | |
| 2 | Ultra-thin gate oxide reliability in the ESD time domain | 2006 | 34 |
| 3 | 2008 | 32 | |
| 4 | Advanced simulation methods for ESD protection development | 2003 | 29 |
| 5 | 2002 | 29 | |
| 6 | 2000 | 27 | |
| 7 | 2004 | 24 | |
| 8 | Evaluation of diode-based and NMOS/Lnpn-based ESD protection strategies in a triple gate oxide thickness 0.13 µm CMOS logic technology | 2001 | 21 |
| 9 | 2007 | 20 | |
| 10 | 2004 | 18 | |
| 11 | 2009 | 17 | |
| 12 | 2000 | 15 | |
| 13 | 2015 | 15 | |
| 14 | 2002 | 15 | |
| 15 | 2003 | 14 | |
| 16 | 2011 | 13 | |
| 17 | Study of trigger instabilities in smart power technology ESD protection devices using a laser interferometric thermal mapping technique | 2001 | 12 |
| 18 | 2001 | 12 | |
| 19 | 2004 | 11 | |
| 20 | 2009 | 11 |
About Kai Esmark
Kai Esmark is a scholar working on Electrical and Electronic Engineering, Materials Chemistry, Hardware and Architecture, Electronic, Optical and Magnetic Materials and Infectious Diseases, having authored 58 papers that have together received 576 indexed citations. Recurring topics across this work include Electrostatic Discharge in Electronics (57 papers), Integrated Circuits and Semiconductor Failure Analysis (37 papers), Semiconductor materials and devices (36 papers), Electromagnetic Compatibility and Noise Suppression (17 papers), Advancements in Semiconductor Devices and Circuit Design (9 papers), Silicon Carbide Semiconductor Technologies (4 papers), 3D IC and TSV technologies (3 papers) and High voltage insulation and dielectric phenomena (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (572 citations), Hardware and Architecture (29 citations), Condensed Matter Physics (19 citations), Atomic and Molecular Physics, and Optics (12 citations) and Materials Chemistry (15 citations). Kai Esmark has collaborated with scholars based in Germany, Austria and Switzerland. Frequent co-authors include Wolfgang Stadler, Harald Goßner, D. Pogány, E. Gornik, M. Stecher, Martin Litzenberger, S. Bychikhin, G. Groos, Wolf Fïchtner and K. Domański. Their work appears in journals such as Microelectronics Reliability, Journal of Electrostatics, IEEE Transactions on Electron Devices, IEEE Transactions on Device and Materials Reliability and Advances in radio science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.