Kai Esmark
Impact in
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- Electrostatic Discharge in Electronics
- Integrated Circuits and Semiconductor Failure Analysis
- Semiconductor materials and devices
- Electromagnetic Compatibility and Noise Suppression
- Advancements in Semiconductor Devices and Circuit Design
- Silicon Carbide Semiconductor Technologies
- Thin-Film Transistor Technologies
-
- Physical Unclonable Functions (PUFs) and Hardware Security
Papers in
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- Electrostatic Discharge in Electronics 58
- Semiconductor materials and devices 40
- Integrated Circuits and Semiconductor Failure Analysis 38
- Electromagnetic Compatibility and Noise Suppression 15
- Advancements in Semiconductor Devices and Circuit Design 13
- 3D IC and TSV technologies 3
- Silicon Carbide Semiconductor Technologies 2
- Co-authors
- Wolfgang Stadler (26 shared papers)Harald Goßner (24 shared papers)Dionyz Pogany (16 shared papers)E. Gornik (16 shared papers)M. Stecher (8 shared papers)Martin Litzenberger (11 shared papers)Sergey Bychikhin (5 shared papers)Gerhard Groos (5 shared papers)
- Journals
- Microelectronics Reliability (16 papers)IEEE Transactions on Device and Materials Reliability (2 papers)Journal of Electrostatics (2 papers)IEEE Transactions on Electron Devices (2 papers)Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) (2 papers)
- Partner nations
- GermanyAustriaSwitzerland
In The Last Decade
Kai Esmark
58 papers receiving 582 citations
Peers
Comparison fields: 5 of 19
- Electrical and Electronic Engineering 604
- Hardware and Architecture 30
- Condensed Matter Physics 20
- Atomic and Molecular Physics, and Optics 14
- Materials Chemistry 13
Countries citing papers authored by Kai Esmark
This map shows the geographic impact of Kai Esmark's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kai Esmark with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kai Esmark more than expected).
Fields of papers citing papers by Kai Esmark
This network shows the impact of papers produced by Kai Esmark. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kai Esmark. The network helps show where Kai Esmark may publish in the future.
Co-authors
The 25 scholars most cited alongside Kai Esmark, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 60 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2002 | 50 | |
| 2 | Ultra-thin gate oxide reliability in the ESD time domain | 2006 | 35 |
| 3 | 2007 | 35 | |
| 4 | 2008 | 29 | |
| 5 | 2000 | 28 | |
| 6 | 2002 | 27 | |
| 7 | 2004 | 26 | |
| 8 | 2007 | 20 | |
| 9 | 2003 | 18 | |
| 10 | 2004 | 18 | |
| 11 | 2002 | 17 | |
| 12 | 2009 | 16 | |
| 13 | 2015 | 15 | |
| 14 | 2000 | 15 | |
| 15 | 2003 | 15 | |
| 16 | 2009 | 14 | |
| 17 | Study of trigger instabilities in smart power technology ESD protection devices using a laser interferometric thermal mapping technique | 2001 | 13 |
| 18 | 2011 | 13 | |
| 19 | 2001 | 13 | |
| 20 | Test Circuits for Fast and Reliable Assessment of CDM Robustness of I/O stages | 2003 | 11 |
About Kai Esmark
Kai Esmark is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Materials Chemistry, Electronic, Optical and Magnetic Materials and Insect Science, having authored 60 papers that have together received 609 indexed citations. Recurring topics across this work include Electrostatic Discharge in Electronics (58 papers), Semiconductor materials and devices (40 papers), Integrated Circuits and Semiconductor Failure Analysis (38 papers), Electromagnetic Compatibility and Noise Suppression (15 papers), Advancements in Semiconductor Devices and Circuit Design (13 papers), 3D IC and TSV technologies (3 papers), High voltage insulation and dielectric phenomena (3 papers) and Silicon Carbide Semiconductor Technologies (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (604 citations), Hardware and Architecture (30 citations), Condensed Matter Physics (20 citations), Atomic and Molecular Physics, and Optics (14 citations) and Materials Chemistry (13 citations). Kai Esmark has collaborated with scholars based in Germany, Austria and Switzerland. Frequent co-authors include Wolfgang Stadler, Harald Goßner, Dionyz Pogany, E. Gornik, M. Stecher, Martin Litzenberger, Sergey Bychikhin, Gerhard Groos, Wolf Fïchtner and Thomas Pompl. Their work appears in journals such as Microelectronics Reliability, IEEE Transactions on Device and Materials Reliability, Journal of Electrostatics, IEEE Transactions on Electron Devices and Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.