John Barrett
Impact in
- Human-Computer Interaction top 5%
- Virtual Reality Applications and Impacts
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electrodeposition and Electroless Coatings
Papers in
-
- Electronic Packaging and Soldering Technologies 22
- 3D IC and TSV technologies 13
- Ultra-Wideband Communications Technology 6
- Electrostatic Discharge in Electronics 5
- Advanced MEMS and NEMS Technologies 5
- Microwave Engineering and Waveguides 4
-
- Material Properties and Processing 4
- Co-authors
- Howard Ehrlichman (2 shared papers)G. Kelly (6 shared papers)Christian Timmerer (2 shared papers)Yuansong Qiao (2 shared papers)Niall Murray (2 shared papers)W. E. Quinn (3 shared papers)Ger Kelly (3 shared papers)C. Lyden (5 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (7 papers)IEEE Transactions on Advanced Packaging (2 papers)IEEE Microwave and Wireless Components Letters (2 papers)IEEE Transactions on Components and Packaging Technologies (2 papers)Microelectronic Engineering (1 paper)
- Partner nations
- IrelandUnited StatesFrance
In The Last Decade
John Barrett
65 papers receiving 786 citations
Peers
Comparison fields: 5 of 94
- Human-Computer Interaction 101
- Electrical and Electronic Engineering 450
- Cognitive Neuroscience 135
- Mechanics of Materials 118
- Mechanical Engineering 162
Countries citing papers authored by John Barrett
This map shows the geographic impact of John Barrett's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by John Barrett with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites John Barrett more than expected).
Fields of papers citing papers by John Barrett
This network shows the impact of papers produced by John Barrett. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by John Barrett. The network helps show where John Barrett may publish in the future.
Co-authors
The 25 scholars most cited alongside John Barrett, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 65 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2016 | 139 | |
| 2 | 1983 | 85 | |
| 3 | 1996 | 83 | |
| 4 | 2012 | 48 | |
| 5 | 1995 | 44 | |
| 6 | 2002 | 32 | |
| 7 | 1997 | 29 | |
| 8 | 1997 | 25 | |
| 9 | 1999 | 21 | |
| 10 | 2006 | 19 | |
| 11 | 2011 | 18 | |
| 12 | 1995 | 17 | |
| 13 | 1982 | 16 | |
| 14 | 2011 | 16 | |
| 15 | 2009 | 15 | |
| 16 | 1992 | 15 | |
| 17 | 2017 | 15 | |
| 18 | 2008 | 14 | |
| 19 | 2005 | 14 | |
| 20 | 1995 | 11 |
About John Barrett
John Barrett is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Biomedical Engineering and Automotive Engineering, having authored 65 papers that have together received 849 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (13 papers), Ultra-Wideband Communications Technology (6 papers), Gyrotron and Vacuum Electronics Research (5 papers), Electrostatic Discharge in Electronics (5 papers), Advanced MEMS and NEMS Technologies (5 papers), Microwave Engineering and Waveguides (4 papers) and Material Properties and Processing (4 papers). The work is most often cited by research in Human-Computer Interaction (101 citations), Electrical and Electronic Engineering (450 citations), Cognitive Neuroscience (135 citations), Mechanics of Materials (118 citations) and Mechanical Engineering (162 citations). John Barrett has collaborated with scholars based in Ireland, United States and France. Frequent co-authors include Howard Ehrlichman, G. Kelly, Christian Timmerer, Yuansong Qiao, Niall Murray, W. E. Quinn, Ger Kelly, C. Lyden, Matthew O’Reilly and G.M. Crean. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Advanced Packaging, IEEE Microwave and Wireless Components Letters, IEEE Transactions on Components and Packaging Technologies and Microelectronic Engineering.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.