Guo‐Quan Lu
Impact in
- Ceramics and Composites top 1%
- Advanced ceramic materials synthesis
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Silicon Carbide Semiconductor Technologies
- Nanomaterials and Printing Technologies
- Electromagnetic Compatibility and Noise Suppression
- Advanced DC-DC Converters
Papers in
-
- Electronic Packaging and Soldering Technologies 175
- 3D IC and TSV technologies 128
- Silicon Carbide Semiconductor Technologies 102
- Electromagnetic Compatibility and Noise Suppression 44
- Advanced DC-DC Converters 27
- Nanomaterials and Printing Technologies 25
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- Aluminum Alloys Composites Properties 36
- Co-authors
- Yunhui Mei (108 shared papers)Xu Chen (54 shared papers)Khai D. T. Ngo (90 shared papers)Jesus N. Calata (32 shared papers)John G. Bai (8 shared papers)Gang Chen (23 shared papers)Xin Li (29 shared papers)Xingsheng Liu (20 shared papers)
- Journals
- IEEE Transactions on Power Electronics (19 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (18 papers)IEEE Transactions on Device and Materials Reliability (15 papers)Microelectronics Reliability (13 papers)Journal of Electronic Materials (12 papers)
- Partner nations
- United StatesChinaFrance
In The Last Decade
Guo‐Quan Lu
330 papers receiving 7.9k citations
Peers
Comparison fields: 5 of 113
- Ceramics and Composites 647
- Electrical and Electronic Engineering 6.5k
- Mechanical Engineering 3.3k
- Electronic, Optical and Magnetic Materials 829
- Automotive Engineering 412
Countries citing papers authored by Guo‐Quan Lu
This map shows the geographic impact of Guo‐Quan Lu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Guo‐Quan Lu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Guo‐Quan Lu more than expected).
Fields of papers citing papers by Guo‐Quan Lu
This network shows the impact of papers produced by Guo‐Quan Lu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Guo‐Quan Lu. The network helps show where Guo‐Quan Lu may publish in the future.
Co-authors
The 25 scholars most cited alongside Guo‐Quan Lu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 338 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2006 | 328 | |
| 2 | 2007 | 299 | |
| 3 | 2009 | 202 | |
| 4 | 2002 | 187 | |
| 5 | 2006 | 186 | |
| 6 | 2007 | 155 | |
| 7 | 2009 | 148 | |
| 8 | 1991 | 135 | |
| 9 | 2007 | 128 | |
| 10 | 1991 | 122 | |
| 11 | 2014 | 107 | |
| 12 | 2021 | 104 | |
| 13 | 2015 | 102 | |
| 14 | 2010 | 96 | |
| 15 | 2011 | 85 | |
| 16 | 2017 | 81 | |
| 17 | 2009 | 80 | |
| 18 | 1993 | 79 | |
| 19 | 2002 | 78 | |
| 20 | 2013 | 75 |
About Guo‐Quan Lu
Guo‐Quan Lu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Materials Chemistry, Electronic, Optical and Magnetic Materials and Mechanics of Materials, having authored 338 papers that have together received 8.2k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (175 papers), 3D IC and TSV technologies (128 papers), Silicon Carbide Semiconductor Technologies (102 papers), Electromagnetic Compatibility and Noise Suppression (44 papers), Aluminum Alloys Composites Properties (36 papers), Advanced DC-DC Converters (27 papers), Thermal properties of materials (26 papers) and Nanomaterials and Printing Technologies (25 papers). The work is most often cited by research in Ceramics and Composites (647 citations), Electrical and Electronic Engineering (6.5k citations), Mechanical Engineering (3.3k citations), Electronic, Optical and Magnetic Materials (829 citations) and Automotive Engineering (412 citations). Guo‐Quan Lu has collaborated with scholars based in United States, China and France. Frequent co-authors include Yunhui Mei, Xu Chen, Khai D. T. Ngo, Jesus N. Calata, John G. Bai, Gang Chen, Xin Li, Xingsheng Liu, Xin Li and Guangyin Lei. Their work appears in journals such as IEEE Transactions on Power Electronics, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Device and Materials Reliability, Microelectronics Reliability and Journal of Electronic Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.