Guo‐Quan Lu
About
Guo‐Quan Lu has authored 245 papers that have received a total of 5.5k indexed citations.
This includes 203 papers in Electrical and Electronic Engineering, 84 papers in Mechanical Engineering and 52 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (119 papers), 3D IC and TSV technologies (84 papers) and Silicon Carbide Semiconductor Technologies (71 papers). Guo‐Quan Lu is often cited by papers focused on Electronic Packaging and Soldering Technologies (119 papers), 3D IC and TSV technologies (84 papers) and Silicon Carbide Semiconductor Technologies (71 papers) and collaborates with scholars based in United States, China and France. Guo‐Quan Lu's co-authors include Yunhui Mei, Xu Chen, Khai D. T. Ngo and Gang Chen and has published in prestigious journals such as Journal of Applied Physics, Polymer and IEEE Transactions on Industrial Electronics.
In The Last Decade
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