Chao Ding
Impact in
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
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- Ga2O3 and related materials
Papers in
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- 3D IC and TSV technologies 9
- Advanced DC-DC Converters 8
- Silicon Carbide Semiconductor Technologies 7
- Wireless Power Transfer Systems 4
- Nanomaterials and Printing Technologies 3
- Multilevel Inverters and Converters 2
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- Additive Manufacturing and 3D Printing Technologies 8
- Co-authors
- Guo‐Quan Lu (19 shared papers)Khai D. T. Ngo (15 shared papers)Yunhui Mei (9 shared papers)Zichen Zhang (2 shared papers)Yuhao Zhang (1 shared paper)Jingcun Liu (1 shared paper)Boyan Wang (1 shared paper)Ming Xiao (1 shared paper)
- Journals
- IEEE Transactions on Power Electronics (3 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)IEEE Transactions on Industry Applications (2 papers)Materials (2 papers)IEEE Journal of Emerging and Selected Topics in Power Electronics (2 papers)
- Partner nations
- United StatesChinaFrance
In The Last Decade
Chao Ding
24 papers receiving 412 citations
Peers
Comparison fields: 5 of 38
- Automotive Engineering 80
- Electronic, Optical and Magnetic Materials 114
- Electrical and Electronic Engineering 247
- Mechanical Engineering 117
- Ceramics and Composites 14
Countries citing papers authored by Chao Ding
This map shows the geographic impact of Chao Ding's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chao Ding with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chao Ding more than expected).
Fields of papers citing papers by Chao Ding
This network shows the impact of papers produced by Chao Ding. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chao Ding. The network helps show where Chao Ding may publish in the future.
Co-authors
The 25 scholars most cited alongside Chao Ding, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 24 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2021 | 102 | |
| 2 | 2021 | 61 | |
| 3 | 2018 | 34 | |
| 4 | 2016 | 31 | |
| 5 | 2020 | 25 | |
| 6 | 2018 | 19 | |
| 7 | 2021 | 15 | |
| 8 | 2021 | 14 | |
| 9 | 2017 | 13 | |
| 10 | 2017 | 13 | |
| 11 | 2023 | 12 | |
| 12 | 2023 | 12 | |
| 13 | 2021 | 11 | |
| 14 | 2024 | 11 | |
| 15 | 2019 | 8 | |
| 16 | 2019 | 7 | |
| 17 | 2021 | 6 | |
| 18 | 2018 | 5 | |
| 19 | 2019 | 5 | |
| 20 | 2019 | 5 |
About Chao Ding
Chao Ding is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Mechanical Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials, having authored 24 papers that have together received 417 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (9 papers), Advanced DC-DC Converters (8 papers), Additive Manufacturing and 3D Printing Technologies (8 papers), Silicon Carbide Semiconductor Technologies (7 papers), Advanced Sensor and Energy Harvesting Materials (5 papers), Wireless Power Transfer Systems (4 papers), Nanomaterials and Printing Technologies (3 papers) and Multilevel Inverters and Converters (2 papers). The work is most often cited by research in Automotive Engineering (80 citations), Electronic, Optical and Magnetic Materials (114 citations), Electrical and Electronic Engineering (247 citations), Mechanical Engineering (117 citations) and Ceramics and Composites (14 citations). Chao Ding has collaborated with scholars based in United States, China and France. Frequent co-authors include Guo‐Quan Lu, Khai D. T. Ngo, Yunhui Mei, Zichen Zhang, Yuhao Zhang, Jingcun Liu, Boyan Wang, Ming Xiao, Cyril Buttay and Ruizhe Zhang. Their work appears in journals such as IEEE Transactions on Power Electronics, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Industry Applications, Materials and IEEE Journal of Emerging and Selected Topics in Power Electronics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.