Patrick Thompson
Impact in
- General Materials Science top 5%
Papers in
-
- Electronic Packaging and Soldering Technologies 31
- 3D IC and TSV technologies 22
- Integrated Circuits and Semiconductor Failure Analysis 4
- Electrodeposition and Electroless Coatings 3
-
- Aluminum Alloys Composites Properties 7
- Co-authors
- D. R. Frear (1 shared paper)P. G. Kim (1 shared paper)K. N. Tu (1 shared paper)Jihun Jang (1 shared paper)Peter Børgesen (8 shared papers)Geir Strandenes (3 shared papers)Luke Wentlent (2 shared papers)Elon Glassberg (3 shared papers)
- Journals
- Journal of Electronic Packaging (3 papers)IEEE Transactions on Electronics Packaging Manufacturing (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)The Journal of Trauma: Injury, Infection, and Critical Care (2 papers)Transfusion (1 paper)
- Partner nations
- United StatesNorwayJapan
In The Last Decade
Patrick Thompson
49 papers receiving 543 citations
Peers
Comparison fields: 5 of 67
- General Materials Science 33
- Critical Care and Intensive Care Medicine 42
- Electrical and Electronic Engineering 449
- Mechanical Engineering 247
- Emergency Medicine 25
Countries citing papers authored by Patrick Thompson
This map shows the geographic impact of Patrick Thompson's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Patrick Thompson with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Patrick Thompson more than expected).
Fields of papers citing papers by Patrick Thompson
This network shows the impact of papers produced by Patrick Thompson. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Patrick Thompson. The network helps show where Patrick Thompson may publish in the future.
Co-authors
The 25 scholars most cited alongside Patrick Thompson, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 51 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1999 | 259 | |
| 2 | 2015 | 34 | |
| 3 | 2000 | 21 | |
| 4 | 1997 | 19 | |
| 5 | 2002 | 16 | |
| 6 | 2020 | 15 | |
| 7 | 2020 | 14 | |
| 8 | 2002 | 14 | |
| 9 | 2018 | 14 | |
| 10 | 2021 | 13 | |
| 11 | 1984 | 13 | |
| 12 | 2019 | 13 | |
| 13 | 2022 | 11 | |
| 14 | 2016 | 10 | |
| 15 | 2019 | 9 | |
| 16 | 2002 | 6 | |
| 17 | 2022 | 5 | |
| 18 | 2020 | 5 | |
| 19 | 2021 | 5 | |
| 20 | 2009 | 5 |
About Patrick Thompson
Patrick Thompson is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials and Industrial and Manufacturing Engineering, having authored 51 papers that have together received 581 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (22 papers), Copper Interconnects and Reliability (8 papers), Aluminum Alloys Composites Properties (7 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers), Manufacturing Process and Optimization (4 papers), Trauma, Hemostasis, Coagulopathy, Resuscitation (3 papers) and Electrodeposition and Electroless Coatings (3 papers). The work is most often cited by research in General Materials Science (33 citations), Critical Care and Intensive Care Medicine (42 citations), Electrical and Electronic Engineering (449 citations), Mechanical Engineering (247 citations) and Emergency Medicine (25 citations). Patrick Thompson has collaborated with scholars based in United States, Norway and Japan. Frequent co-authors include D. R. Frear, P. G. Kim, K. N. Tu, Jihun Jang, Peter Børgesen, Geir Strandenes, Luke Wentlent, Elon Glassberg, S. W. Ricky Lee and Philip C. Spinella. Their work appears in journals such as Journal of Electronic Packaging, IEEE Transactions on Electronics Packaging Manufacturing, IEEE Transactions on Components Packaging and Manufacturing Technology, The Journal of Trauma: Injury, Infection, and Critical Care and Transfusion.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.