S.H. Mannan
Impact in
- Mechanical Engineering top 1%
- Aluminum Alloys Composites Properties
- Intermetallics and Advanced Alloy Properties
- Advanced Welding Techniques Analysis
- High Temperature Alloys and Creep
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
Papers in
-
- Electronic Packaging and Soldering Technologies 79
- 3D IC and TSV technologies 39
- Nanomaterials and Printing Technologies 13
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- Intermetallics and Advanced Alloy Properties 16
- Aluminum Alloys Composites Properties 9
- Co-authors
- Hiren R. Kotadia (19 shared papers)Seyed Amir Paknejad (10 shared papers)Philip D. Howes (1 shared paper)M.P. Clode (21 shared papers)D.C. Whalley (28 shared papers)David A. Hutt (17 shared papers)Jianfeng Li (10 shared papers)David Williams (8 shared papers)
- Journals
- Acta Materialia (5 papers)International Journal of Fatigue (5 papers)Journal of Electronic Materials (4 papers)Journal of Materials Science Materials in Electronics (3 papers)Microelectronics Reliability (3 papers)
- Partner nations
- United KingdomHong KongIndia
In The Last Decade
S.H. Mannan
105 papers receiving 2.3k citations
S.H. Mannan's Hit Papers
Peers
Comparison fields: 5 of 65
- Mechanical Engineering 1.4k
- Electrical and Electronic Engineering 1.8k
- General Materials Science 87
- Metals and Alloys 52
- Mechanics of Materials 325
Countries citing papers authored by S.H. Mannan
This map shows the geographic impact of S.H. Mannan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S.H. Mannan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S.H. Mannan more than expected).
Fields of papers citing papers by S.H. Mannan
This network shows the impact of papers produced by S.H. Mannan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S.H. Mannan. The network helps show where S.H. Mannan may publish in the future.
Co-authors
The 25 scholars most cited alongside S.H. Mannan, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 109 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | A review: On the development of low melting temperature Pb-free solders Hit paper breakdown → | 2014 | 396 |
| 2 | 2006 | 197 | |
| 3 | 2017 | 196 | |
| 4 | 1991 | 125 | |
| 5 | 2011 | 109 | |
| 6 | 2014 | 108 | |
| 7 | 2006 | 54 | |
| 8 | 2004 | 53 | |
| 9 | 2002 | 49 | |
| 10 | 2010 | 48 | |
| 11 | 2022 | 45 | |
| 12 | 1998 | 43 | |
| 13 | 1995 | 40 | |
| 14 | 2020 | 39 | |
| 15 | 2002 | 38 | |
| 16 | 1994 | 31 | |
| 17 | 1990 | 30 | |
| 18 | 2016 | 29 | |
| 19 | 2020 | 29 | |
| 20 | 2007 | 28 |
About S.H. Mannan
S.H. Mannan is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Electronic, Optical and Magnetic Materials and Materials Chemistry, having authored 109 papers that have together received 2.4k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (79 papers), 3D IC and TSV technologies (39 papers), Intermetallics and Advanced Alloy Properties (16 papers), Nanomaterials and Printing Technologies (13 papers), Copper Interconnects and Reliability (13 papers), Aluminum Alloys Composites Properties (9 papers), Metallurgical and Alloy Processes (9 papers) and Material Properties and Processing (6 papers). The work is most often cited by research in Mechanical Engineering (1.4k citations), Electrical and Electronic Engineering (1.8k citations), General Materials Science (87 citations), Metals and Alloys (52 citations) and Mechanics of Materials (325 citations). S.H. Mannan has collaborated with scholars based in United Kingdom, Hong Kong and India. Frequent co-authors include Hiren R. Kotadia, Seyed Amir Paknejad, Philip D. Howes, M.P. Clode, D.C. Whalley, David A. Hutt, Jianfeng Li, David Williams, N.N. Ekere and Omid Mokhtari. Their work appears in journals such as Acta Materialia, International Journal of Fatigue, Journal of Electronic Materials, Journal of Materials Science Materials in Electronics and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.