Chia‐Ming Hsu

33 papers and 642 indexed citations i.

Chia‐Ming Hsu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Aerospace Engineering. According to data from OpenAlex, Chia‐Ming Hsu has authored 33 papers receiving a total of 642 indexed citations (citations by other indexed papers that have themselves been cited), including 18 papers in Electrical and Electronic Engineering, 17 papers in Mechanical Engineering and 6 papers in Aerospace Engineering. Recurrent topics in Chia‐Ming Hsu’s work include Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (6 papers) and Semiconductor materials and interfaces (5 papers). Chia‐Ming Hsu is often cited by papers focused on Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (6 papers) and Semiconductor materials and interfaces (5 papers). Chia‐Ming Hsu collaborates with scholars based in Taiwan, United States and Japan. Chia‐Ming Hsu's co-authors include H.C. Shih, J.W. Yeh, Y. Y. Chen, Sinn-wen Chen, Jien‐Wei Yeh, Y.Y. Chen, Chih Chen, T. L. Shao, D. J. Yao and Shih‐kang Lin and has published in prestigious journals such as The Astrophysical Journal, Applied Physics Letters and Journal of Applied Physics.