Shih‐kang Lin

101 papers and 1.8k indexed citations i.

Shih‐kang Lin has authored 101 papers that have received a total of 1.8k indexed citations. This includes 84 papers in Electrical and Electronic Engineering, 45 papers in Mechanical Engineering and 21 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (47 papers), Advancements in Battery Materials (26 papers) and 3D IC and TSV technologies (25 papers). Shih‐kang Lin is often cited by papers focused on Electronic Packaging and Soldering Technologies (47 papers), Advancements in Battery Materials (26 papers) and 3D IC and TSV technologies (25 papers) and collaborates with scholars based in Taiwan, Japan and United States. Shih‐kang Lin's co-authors include Sinn-wen Chen, Yuchen Liu, Hiroshi Nishikawa, Martin Ihrig and Katsuaki Suganuma and has published in prestigious journals such as ACS Nano, Journal of Applied Physics and Chemistry of Materials.