Chao-hong Wang
Impact in
- General Materials Science top 0.5%
- Metallurgical and Alloy Processes
- Microbiology top 5%
Papers in
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- Electronic Packaging and Soldering Technologies 57
- 3D IC and TSV technologies 30
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- Intermetallics and Advanced Alloy Properties 31
- Advanced Welding Techniques Analysis 12
- Co-authors
- Sinn-wen Chen (23 shared papers)Chih‐Hao Lin (1 shared paper)Chun‐Wei Chiu (5 shared papers)Ling Zhou (5 shared papers)Yahui Tian (5 shared papers)Fei Xue (5 shared papers)Qiuyun Fu (5 shared papers)Jianlin Liu (3 shared papers)
In The Last Decade
Chao-hong Wang
93 papers receiving 1.5k citations
Peers
Comparison fields: 5 of 66
- General Materials Science 138
- Microbiology 17
- Mechanical Engineering 873
- Electrical and Electronic Engineering 1.1k
- Electronic, Optical and Magnetic Materials 195
Countries citing papers authored by Chao-hong Wang
This map shows the geographic impact of Chao-hong Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chao-hong Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chao-hong Wang more than expected).
Fields of papers citing papers by Chao-hong Wang
This network shows the impact of papers produced by Chao-hong Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chao-hong Wang. The network helps show where Chao-hong Wang may publish in the future.
Co-authors
The 25 scholars most cited alongside Chao-hong Wang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 97 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2002 | 141 | |
| 2 | 2008 | 70 | |
| 3 | 2017 | 55 | |
| 4 | 2010 | 51 | |
| 5 | 2009 | 49 | |
| 6 | 2007 | 46 | |
| 7 | 2012 | 45 | |
| 8 | 2006 | 42 | |
| 9 | 2011 | 41 | |
| 10 | 2010 | 39 | |
| 11 | 2015 | 39 | |
| 12 | 2017 | 39 | |
| 13 | 2011 | 38 | |
| 14 | 2006 | 35 | |
| 15 | 2017 | 33 | |
| 16 | 2007 | 32 | |
| 17 | 2014 | 30 | |
| 18 | 2010 | 29 | |
| 19 | 2014 | 27 | |
| 20 | 2017 | 27 |
About Chao-hong Wang
Chao-hong Wang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Materials Chemistry, General Materials Science and Electronic, Optical and Magnetic Materials, having authored 97 papers that have together received 1.5k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (57 papers), Intermetallics and Advanced Alloy Properties (31 papers), 3D IC and TSV technologies (30 papers), Advanced Welding Techniques Analysis (12 papers), Metallurgical and Alloy Processes (10 papers), Advanced Thermoelectric Materials and Devices (8 papers), Aluminum Alloy Microstructure Properties (6 papers) and Semiconductor materials and interfaces (6 papers). The work is most often cited by research in General Materials Science (138 citations), Microbiology (17 citations), Mechanical Engineering (873 citations), Electrical and Electronic Engineering (1.1k citations) and Electronic, Optical and Magnetic Materials (195 citations). Chao-hong Wang has collaborated with scholars based in Taiwan, China and Sri Lanka. Frequent co-authors include Sinn-wen Chen, Chih‐Hao Lin, Chun‐Wei Chiu, Ling Zhou, Yahui Tian, Fei Xue, Qiuyun Fu, Jianlin Liu, Jiansheng Zhu and Dongxiang Zhou. Their work appears in journals such as Journal of Electronic Materials, Intermetallics, Journal of Alloys and Compounds, Materials Chemistry and Physics and Metallurgical and Materials Transactions A.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.