T. L. Shao

12 papers and 314 indexed citations i.

T. L. Shao has authored 12 papers that have received a total of 314 indexed citations. This includes 12 papers in Electrical and Electronic Engineering, 5 papers in Electronic, Optical and Magnetic Materials and 3 papers in Mechanical Engineering. The topics of these papers are 3D IC and TSV technologies (12 papers), Electronic Packaging and Soldering Technologies (11 papers) and Copper Interconnects and Reliability (5 papers). T. L. Shao is often cited by papers focused on 3D IC and TSV technologies (12 papers), Electronic Packaging and Soldering Technologies (11 papers) and Copper Interconnects and Reliability (5 papers) and collaborates with scholars based in Taiwan, United States and China. T. L. Shao's co-authors include Chih Chen, Shuqi Liang, D. J. Yao, K. N. Tu and Sheng-Yi Hsiao and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of materials research/Pratt's guide to venture capital sources.