N.N. Ekere
Impact in
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- Rheology and Fluid Dynamics Studies
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Silicon and Solar Cell Technologies
Papers in
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- Electronic Packaging and Soldering Technologies 77
- 3D IC and TSV technologies 34
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- Injection Molding Process and Properties 12
- Co-authors
- Emeka H. Amalu (26 shared papers)R. Durairaj (34 shared papers)Sabuj Mallik (36 shared papers)Donglin He (5 shared papers)Raj Bhatti (18 shared papers)Li Feng Cai (4 shared papers)Chike F. Oduoza (4 shared papers)Kenny C. Otiaba (9 shared papers)
- Journals
- Microelectronics Reliability (5 papers)Journal of Materials Science Materials in Electronics (4 papers)Solar Energy (3 papers)IEEE Transactions on Electronics Packaging Manufacturing (2 papers)Journal of Materials Engineering and Performance (2 papers)
- Partner nations
- United KingdomMalaysiaGhana
In The Last Decade
N.N. Ekere
123 papers receiving 2.4k citations
Peers
Comparison fields: 5 of 109
- Fluid Flow and Transfer Processes 266
- Electrical and Electronic Engineering 1.5k
- Mechanical Engineering 700
- Mechanics of Materials 391
- Industrial and Manufacturing Engineering 167
Countries citing papers authored by N.N. Ekere
This map shows the geographic impact of N.N. Ekere's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by N.N. Ekere with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites N.N. Ekere more than expected).
Fields of papers citing papers by N.N. Ekere
This network shows the impact of papers produced by N.N. Ekere. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by N.N. Ekere. The network helps show where N.N. Ekere may publish in the future.
Co-authors
The 25 scholars most cited alongside N.N. Ekere, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 126 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1999 | 158 | |
| 2 | 2015 | 137 | |
| 3 | 2011 | 129 | |
| 4 | 2016 | 106 | |
| 5 | 2004 | 79 | |
| 6 | 2023 | 79 | |
| 7 | 2009 | 77 | |
| 8 | 2018 | 76 | |
| 9 | 2012 | 61 | |
| 10 | 2012 | 56 | |
| 11 | 2023 | 55 | |
| 12 | 2017 | 55 | |
| 13 | 2016 | 54 | |
| 14 | 2008 | 49 | |
| 15 | 2004 | 43 | |
| 16 | 2002 | 42 | |
| 17 | 2015 | 42 | |
| 18 | 1996 | 40 | |
| 19 | 2004 | 38 | |
| 20 | 2011 | 38 |
About N.N. Ekere
N.N. Ekere is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Fluid Flow and Transfer Processes and Control and Systems Engineering, having authored 126 papers that have together received 2.5k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (77 papers), 3D IC and TSV technologies (34 papers), Rheology and Fluid Dynamics Studies (30 papers), Material Properties and Processing (27 papers), Vibration and Dynamic Analysis (13 papers), Injection Molding Process and Properties (12 papers), Additive Manufacturing and 3D Printing Technologies (10 papers) and Fluid Dynamics and Thin Films (8 papers). The work is most often cited by research in Fluid Flow and Transfer Processes (266 citations), Electrical and Electronic Engineering (1.5k citations), Mechanical Engineering (700 citations), Mechanics of Materials (391 citations) and Industrial and Manufacturing Engineering (167 citations). N.N. Ekere has collaborated with scholars based in United Kingdom, Malaysia and Ghana. Frequent co-authors include Emeka H. Amalu, R. Durairaj, Sabuj Mallik, Donglin He, Raj Bhatti, Li Feng Cai, Chike F. Oduoza, Kenny C. Otiaba, Da He and B. Salam. Their work appears in journals such as Microelectronics Reliability, Journal of Materials Science Materials in Electronics, Solar Energy, IEEE Transactions on Electronics Packaging Manufacturing and Journal of Materials Engineering and Performance.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.