J. J. Clement
Impact in
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- Copper Interconnects and Reliability
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- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- 3D IC and TSV technologies
- Electrodeposition and Electroless Coatings
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
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- Semiconductor materials and devices 16
- Electronic Packaging and Soldering Technologies 11
- Integrated Circuits and Semiconductor Failure Analysis 3
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- Copper Interconnects and Reliability 20
- Co-authors
- J. R. Lloyd (4 shared papers)Carl V. Thompson (8 shared papers)B. Miner (2 shared papers)Gary H. Bernstein (1 shared paper)Edward I. Cole (2 shared papers)Chee Lip Gan (1 shared paper)Mary Ann Miller (1 shared paper)Stefan P. Hau‐Riege (1 shared paper)
- Journals
- Journal of Applied Physics (5 papers)Applied Physics Letters (1 paper)IEEE Transactions on Electron Devices (1 paper)IEEE Electron Device Letters (1 paper)IEEE Transactions on Device and Materials Reliability (1 paper)
- Partner nations
- United StatesSingapore
In The Last Decade
J. J. Clement
23 papers receiving 689 citations
Peers
Comparison fields: 5 of 31
- Electronic, Optical and Magnetic Materials 621
- Electrical and Electronic Engineering 658
- Mechanics of Materials 138
- Hardware and Architecture 22
- Atomic and Molecular Physics, and Optics 82
Countries citing papers authored by J. J. Clement
This map shows the geographic impact of J. J. Clement's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. J. Clement with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. J. Clement more than expected).
Fields of papers citing papers by J. J. Clement
This network shows the impact of papers produced by J. J. Clement. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. J. Clement. The network helps show where J. J. Clement may publish in the future.
Co-authors
The 15 scholars most cited alongside J. J. Clement, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 23 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1995 | 198 | |
| 2 | 1995 | 83 | |
| 3 | 1997 | 62 | |
| 4 | 1997 | 59 | |
| 5 | 2001 | 57 | |
| 6 | 1992 | 50 | |
| 7 | 1992 | 32 | |
| 8 | 1996 | 31 | |
| 9 | 1998 | 21 | |
| 10 | 1995 | 20 | |
| 11 | 1999 | 19 | |
| 12 | 1993 | 18 | |
| 13 | 1995 | 17 | |
| 14 | 1994 | 14 | |
| 15 | 1996 | 12 | |
| 16 | 2002 | 8 | |
| 17 | 2015 | 6 | |
| 18 | Electromigration Reliability of VLSI Interconnect. | 1992 | 5 |
| 19 | 2014 | 4 | |
| 20 | 1994 | 3 |
About J. J. Clement
J. J. Clement is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics, Mechanics of Materials and Biomedical Engineering, having authored 23 papers that have together received 726 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (20 papers), Semiconductor materials and devices (16 papers), Electronic Packaging and Soldering Technologies (11 papers), Metal and Thin Film Mechanics (4 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers), Semiconductor materials and interfaces (2 papers), Force Microscopy Techniques and Applications (2 papers) and Near-Field Optical Microscopy (2 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (621 citations), Electrical and Electronic Engineering (658 citations), Mechanics of Materials (138 citations), Hardware and Architecture (22 citations) and Atomic and Molecular Physics, and Optics (82 citations). J. J. Clement has collaborated with scholars based in United States and Singapore. Frequent co-authors include J. R. Lloyd, Carl V. Thompson, B. Miner, Gary H. Bernstein, Edward I. Cole, Chee Lip Gan, Mary Ann Miller, Stefan P. Hau‐Riege, Scott Silverman and Huay Ling Tay. Their work appears in journals such as Journal of Applied Physics, Applied Physics Letters, IEEE Transactions on Electron Devices, IEEE Electron Device Letters and IEEE Transactions on Device and Materials Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.