Kunmo Chu
Impact in
- Materials Chemistry top 10%
- Carbon Nanotubes in Composites
- Thermal properties of materials
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- Electronic Packaging and Soldering Technologies
- Nanomaterials and Printing Technologies
- Electrical and Thermal Properties of Materials
Papers in
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- Electronic Packaging and Soldering Technologies 15
- Semiconductor Lasers and Optical Devices 4
- Electrodeposition and Electroless Coatings 1
- Electrical and Thermal Properties of Materials 1
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- Carbon Nanotubes in Composites 9
- Co-authors
- Sung Hoon Park (14 shared papers)Yoonchul Sohn (13 shared papers)Changyoul Moon (5 shared papers)Sang-Eui Lee (5 shared papers)Dongouk Kim (6 shared papers)Duk Young Jeon (10 shared papers)Dong‐Min Kim (2 shared papers)Chan‐Moon Chung (2 shared papers)
- Journals
- IEEE Electron Device Letters (4 papers)IEEE Transactions on Advanced Packaging (3 papers)Journal of Materials Science Materials in Electronics (2 papers)Scripta Materialia (2 papers)Organic Electronics (2 papers)
- Partner nations
- South KoreaGermanyUnited States
In The Last Decade
Kunmo Chu
33 papers receiving 785 citations
Peers
Comparison fields: 5 of 40
- Materials Chemistry 283
- Electrical and Electronic Engineering 374
- Polymers and Plastics 77
- Surfaces, Coatings and Films 30
- Biomedical Engineering 141
Countries citing papers authored by Kunmo Chu
This map shows the geographic impact of Kunmo Chu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kunmo Chu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kunmo Chu more than expected).
Fields of papers citing papers by Kunmo Chu
This network shows the impact of papers produced by Kunmo Chu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kunmo Chu. The network helps show where Kunmo Chu may publish in the future.
Co-authors
The 25 scholars most cited alongside Kunmo Chu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 35 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2018 | 113 | |
| 2 | 2015 | 106 | |
| 3 | 2014 | 101 | |
| 4 | 2013 | 85 | |
| 5 | 2014 | 58 | |
| 6 | 2013 | 44 | |
| 7 | 2015 | 44 | |
| 8 | 2008 | 36 | |
| 9 | 2016 | 24 | |
| 10 | 2019 | 23 | |
| 11 | 2005 | 20 | |
| 12 | 2008 | 18 | |
| 13 | 2014 | 17 | |
| 14 | 2018 | 12 | |
| 15 | 2007 | 11 | |
| 16 | 2018 | 11 | |
| 17 | 2004 | 10 | |
| 18 | 2004 | 8 | |
| 19 | 2006 | 8 | |
| 20 | 2017 | 8 |
About Kunmo Chu
Kunmo Chu is a scholar working on Electrical and Electronic Engineering, Materials Chemistry, Surfaces, Coatings and Films, Polymers and Plastics and Electronic, Optical and Magnetic Materials, having authored 35 papers that have together received 800 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (15 papers), Carbon Nanotubes in Composites (9 papers), Semiconductor Lasers and Optical Devices (4 papers), Surface Modification and Superhydrophobicity (2 papers), Metal and Thin Film Mechanics (1 paper), Electrodeposition and Electroless Coatings (1 paper), Polymer composites and self-healing (1 paper) and Electrical and Thermal Properties of Materials (1 paper). The work is most often cited by research in Materials Chemistry (283 citations), Electrical and Electronic Engineering (374 citations), Polymers and Plastics (77 citations), Surfaces, Coatings and Films (30 citations) and Biomedical Engineering (141 citations). Kunmo Chu has collaborated with scholars based in South Korea, Germany and United States. Frequent co-authors include Sung Hoon Park, Yoonchul Sohn, Changyoul Moon, Sang-Eui Lee, Dongouk Kim, Duk Young Jeon, Dong‐Min Kim, Chan‐Moon Chung, Byong Gwon Song and Sung-Chul Lee. Their work appears in journals such as IEEE Electron Device Letters, IEEE Transactions on Advanced Packaging, Journal of Materials Science Materials in Electronics, Scripta Materialia and Organic Electronics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.