Wayne Johnson
Impact in
- Ceramics and Composites top 2%
- Aerospace Engineering top 0.5%
- Aerospace and Aviation Technology
- Aeroelasticity and Vibration Control
Papers in
-
- Electronic Packaging and Soldering Technologies 94
- 3D IC and TSV technologies 71
- Silicon Carbide Semiconductor Technologies 42
-
- Aerospace and Aviation Technology 50
- Aeroelasticity and Vibration Control 40
- Aerospace Engineering and Control Systems 39
- Co-authors
- Jeff B. Casady (12 shared papers)John L. Evans (15 shared papers)Jeffrey C. Suhling (20 shared papers)J. R. Thompson (2 shared papers)Peter Jacobsen (1 shared paper)R.C. Jaeger (20 shared papers)Michael C. Hamilton (24 shared papers)Christopher J. Silva (5 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (17 papers)IEEE Transactions on Electronics Packaging Manufacturing (16 papers)Journal of the American Helicopter Society (16 papers)Journal of Aircraft (7 papers)Journal of Electronic Packaging (5 papers)
- Partner nations
- United StatesUnited KingdomTaiwan
In The Last Decade
Wayne Johnson
341 papers receiving 7.5k citations
Wayne Johnson's Hit Papers
Peers
Comparison fields: 5 of 144
- Ceramics and Composites 432
- Aerospace Engineering 1.9k
- Electrical and Electronic Engineering 4.1k
- Computational Mechanics 1.0k
- Mechanical Engineering 1.6k
Countries citing papers authored by Wayne Johnson
This map shows the geographic impact of Wayne Johnson's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wayne Johnson with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wayne Johnson more than expected).
Fields of papers citing papers by Wayne Johnson
This network shows the impact of papers produced by Wayne Johnson. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wayne Johnson. The network helps show where Wayne Johnson may publish in the future.
Co-authors
The 25 scholars most cited alongside Wayne Johnson, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 368 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Status of silicon carbide (SiC) as a wide-bandgap semiconductor for high-temperature applications: A review Hit paper breakdown → | 1996 | 1230 |
| 2 | The Changing Automotive Environment: High-Temperature Electronics Hit paper breakdown → | 2004 | 711 |
| 3 | 2018 | 259 | |
| 4 | 1991 | 166 | |
| 5 | 1975 | 161 | |
| 6 | 2016 | 127 | |
| 7 | CAMRAD - A COMPREHENSIVE ANALYTICAL MODEL OF ROTORCRAFT AERODYNAMICS AND DYNAMICS | 1994 | 126 |
| 8 | 2010 | 117 | |
| 9 | 2004 | 107 | |
| 10 | 2009 | 102 | |
| 11 | 2007 | 96 | |
| 12 | 1992 | 94 | |
| 13 | 2005 | 88 | |
| 14 | 2015 | 88 | |
| 15 | Concept Vehicles for VTOL Air Taxi Operations | 2018 | 86 |
| 16 | 2018 | 82 | |
| 17 | 2010 | 76 | |
| 18 | 1986 | 73 | |
| 19 | 1986 | 67 | |
| 20 | 1981 | 59 |
About Wayne Johnson
Wayne Johnson is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering, Mechanical Engineering, Computational Mechanics and Materials Chemistry, having authored 368 papers that have together received 8.1k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (94 papers), 3D IC and TSV technologies (71 papers), Aerospace and Aviation Technology (50 papers), Silicon Carbide Semiconductor Technologies (42 papers), Aeroelasticity and Vibration Control (40 papers), Aerospace Engineering and Control Systems (39 papers), Computational Fluid Dynamics and Aerodynamics (34 papers) and Advanced Aircraft Design and Technologies (23 papers). The work is most often cited by research in Ceramics and Composites (432 citations), Aerospace Engineering (1.9k citations), Electrical and Electronic Engineering (4.1k citations), Computational Mechanics (1.0k citations) and Mechanical Engineering (1.6k citations). Wayne Johnson has collaborated with scholars based in United States, United Kingdom and Taiwan. Frequent co-authors include Jeff B. Casady, John L. Evans, Jeffrey C. Suhling, J. R. Thompson, Peter Jacobsen, R.C. Jaeger, Michael C. Hamilton, Christopher J. Silva, Pradeep Lall and W. Watt. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Electronics Packaging Manufacturing, Journal of the American Helicopter Society, Journal of Aircraft and Journal of Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.