Scott McCann
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Integrated Circuits and Semiconductor Failure Analysis
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- Probabilistic and Robust Engineering Design
Papers in
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- Electronic Packaging and Soldering Technologies 18
- 3D IC and TSV technologies 16
- Electromagnetic Compatibility and Noise Suppression 3
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- Advanced Multi-Objective Optimization Algorithms 5
- Co-authors
- Rao Tummala (13 shared papers)Suresh K. Sitaraman (9 shared papers)Anh Tran (5 shared papers)Venkatesh Sundaram (6 shared papers)Timothy Wildey (3 shared papers)Vanessa Smet (7 shared papers)Yoichiro Sato (3 shared papers)Gamal Refai-Ahmed (4 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (3 papers)IEEE Transactions on Device and Materials Reliability (3 papers)Journal of Mechanical Design (1 paper)Structural and Multidisciplinary Optimization (1 paper)Journal of Electronic Packaging (1 paper)
- Partner nations
- United StatesJapanGermany
In The Last Decade
Scott McCann
26 papers receiving 288 citations
Peers
Comparison fields: 5 of 35
- Electrical and Electronic Engineering 206
- Statistics, Probability and Uncertainty 25
- Computational Theory and Mathematics 33
- Mechanics of Materials 44
- Management Science and Operations Research 22
Countries citing papers authored by Scott McCann
This map shows the geographic impact of Scott McCann's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Scott McCann with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Scott McCann more than expected).
Fields of papers citing papers by Scott McCann
This network shows the impact of papers produced by Scott McCann. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Scott McCann. The network helps show where Scott McCann may publish in the future.
Co-authors
The 25 scholars most cited alongside Scott McCann, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 26 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2017 | 35 | |
| 2 | 2020 | 31 | |
| 3 | 2015 | 29 | |
| 4 | 2018 | 25 | |
| 5 | 2015 | 23 | |
| 6 | 2015 | 15 | |
| 7 | 2016 | 14 | |
| 8 | 2014 | 13 | |
| 9 | 2022 | 13 | |
| 10 | 2017 | 12 | |
| 11 | 2015 | 12 | |
| 12 | 2016 | 12 | |
| 13 | 2018 | 11 | |
| 14 | 2019 | 9 | |
| 15 | 2019 | 9 | |
| 16 | 2020 | 8 | |
| 17 | 2021 | 7 | |
| 18 | 2019 | 7 | |
| 19 | 2017 | 7 | |
| 20 | 2017 | 5 |
About Scott McCann
Scott McCann is a scholar working on Electrical and Electronic Engineering, Computational Theory and Mathematics, Management Science and Operations Research, Mechanics of Materials and Automotive Engineering, having authored 26 papers that have together received 306 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (16 papers), Advanced Multi-Objective Optimization Algorithms (5 papers), Optimal Experimental Design Methods (4 papers), Additive Manufacturing and 3D Printing Technologies (3 papers), Mechanical Behavior of Composites (3 papers), Copper Interconnects and Reliability (3 papers) and Electromagnetic Compatibility and Noise Suppression (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (206 citations), Statistics, Probability and Uncertainty (25 citations), Computational Theory and Mathematics (33 citations), Mechanics of Materials (44 citations) and Management Science and Operations Research (22 citations). Scott McCann has collaborated with scholars based in United States, Japan and Germany. Frequent co-authors include Rao Tummala, Suresh K. Sitaraman, Anh Tran, Venkatesh Sundaram, Timothy Wildey, Vanessa Smet, Yoichiro Sato, Gamal Refai-Ahmed, Venky Sundaram and Bhupender Singh. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Device and Materials Reliability, Journal of Mechanical Design, Structural and Multidisciplinary Optimization and Journal of Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.