Asit Kumar Gain
About
Asit Kumar Gain has authored 62 papers that have received a total of 1.7k indexed citations.
This includes 53 papers in Mechanical Engineering, 32 papers in Electrical and Electronic Engineering and 13 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (21 papers) and Aluminum Alloys Composites Properties (17 papers). Asit Kumar Gain is often cited by papers focused on Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (21 papers) and Aluminum Alloys Composites Properties (17 papers) and collaborates with scholars based in Australia, Hong Kong and China. Asit Kumar Gain's co-authors include K.C. Yung, Liangchi Zhang, Byong‐Taek Lee, Liangchi Zhang and Y.C. Chan and has published in prestigious journals such as Scientific Reports, Journal of the American Ceramic Society and Materials Science and Engineering A.
In The Last Decade
Fields of papers published by Asit Kumar Gain
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by Asit Kumar Gain
Since SpecializationCitations
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