William Cote
Impact in
-
- Copper Interconnects and Reliability
-
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Advancements in Semiconductor Devices and Circuit Design
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
Papers in
-
- VLSI and Analog Circuit Testing 5
-
- Copper Interconnects and Reliability 7
- Co-authors
- Daniel C. Edelstein (3 shared papers)S. E. Luce (2 shared papers)John E. Heidenreich (2 shared papers)Andrew H. Simon (2 shared papers)H. Rathore (2 shared papers)L.T. Su (1 shared paper)John M. Slattery (2 shared papers)Cyprian E. Uzoh (2 shared papers)
- Journals
- Thin Solid Films (1 paper)IEEE Transactions on Semiconductor Manufacturing (1 paper)IBM Journal of Research and Development (1 paper)IEEE Journal of Solid-State Circuits (1 paper)
- Partner nations
- United StatesSwitzerland
In The Last Decade
William Cote
18 papers receiving 496 citations
Peers
Comparison fields: 5 of 40
- Electronic, Optical and Magnetic Materials 229
- Electrical and Electronic Engineering 462
- Hardware and Architecture 41
- Biomedical Engineering 138
- Mechanics of Materials 60
Countries citing papers authored by William Cote
This map shows the geographic impact of William Cote's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by William Cote with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites William Cote more than expected).
Fields of papers citing papers by William Cote
This network shows the impact of papers produced by William Cote. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by William Cote. The network helps show where William Cote may publish in the future.
Co-authors
The 25 scholars most cited alongside William Cote, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2002 | 240 | |
| 2 | 1992 | 83 | |
| 3 | 2002 | 38 | |
| 4 | 1995 | 29 | |
| 5 | 2012 | 24 | |
| 6 | 1987 | 21 | |
| 7 | 2004 | 18 | |
| 8 | 2002 | 17 | |
| 9 | 1991 | 15 | |
| 10 | 2004 | 15 | |
| 11 | 2006 | 15 | |
| 12 | 2008 | 7 | |
| 13 | 2003 | 7 | |
| 14 | 2002 | 6 | |
| 15 | 2020 | 5 | |
| 16 | 2008 | 5 | |
| 17 | 2002 | 2 | |
| 18 | 2022 | 1 | |
| 19 | 2003 | 0 |
About William Cote
William Cote is a scholar working on Hardware and Architecture, Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Acoustics and Ultrasonics and Biophysics, having authored 19 papers that have together received 548 indexed citations. Recurring topics across this work include Semiconductor materials and devices (10 papers), 3D IC and TSV technologies (8 papers), Copper Interconnects and Reliability (7 papers), Integrated Circuits and Semiconductor Failure Analysis (7 papers), VLSI and Analog Circuit Testing (5 papers), Advancements in Semiconductor Devices and Circuit Design (4 papers), Electronic Packaging and Soldering Technologies (4 papers) and VLSI and FPGA Design Techniques (2 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (229 citations), Electrical and Electronic Engineering (462 citations), Hardware and Architecture (41 citations), Biomedical Engineering (138 citations) and Mechanics of Materials (60 citations). William Cote has collaborated with scholars based in United States and Switzerland. Frequent co-authors include Daniel C. Edelstein, S. E. Luce, John E. Heidenreich, Andrew H. Simon, H. Rathore, L.T. Su, John M. Slattery, Cyprian E. Uzoh, John O. Dukovic and Ronald D. Goldblatt. Their work appears in journals such as Thin Solid Films, IEEE Transactions on Semiconductor Manufacturing, IBM Journal of Research and Development and IEEE Journal of Solid-State Circuits.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.