Scott Irving
Impact in
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Silicon Carbide Semiconductor Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Mechanics of Materials top 10%
Papers in
-
- Electronic Packaging and Soldering Technologies 45
- 3D IC and TSV technologies 19
- Silicon Carbide Semiconductor Technologies 6
- Integrated Circuits and Semiconductor Failure Analysis 6
- Electromagnetic Compatibility and Noise Suppression 5
-
- Heat Transfer and Optimization 4
- Co-authors
- Timwah Luk (36 shared papers)Yong Liu (13 shared papers)Lihua Liang (5 shared papers)Yong Liu (3 shared papers)Yong Liu (5 shared papers)Yong Liu (1 shared paper)Dan Kinzer (1 shared paper)Yong Liu (2 shared papers)
- Journals
- IEEE Transactions on Electronics Packaging Manufacturing (2 papers)Microelectronics Reliability (1 paper)International Journal of Heat and Fluid Flow (1 paper)Engineering Failure Analysis (1 paper)
- Partner nations
- United StatesChinaAustralia
In The Last Decade
Scott Irving
49 papers receiving 440 citations
Peers
Comparison fields: 5 of 32
- Electrical and Electronic Engineering 423
- Mechanics of Materials 120
- Electronic, Optical and Magnetic Materials 80
- Mechanical Engineering 133
- Industrial and Manufacturing Engineering 21
Countries citing papers authored by Scott Irving
This map shows the geographic impact of Scott Irving's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Scott Irving with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Scott Irving more than expected).
Fields of papers citing papers by Scott Irving
This network shows the impact of papers produced by Scott Irving. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Scott Irving. The network helps show where Scott Irving may publish in the future.
Co-authors
The 25 scholars most cited alongside Scott Irving, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 52 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2008 | 58 | |
| 2 | 2008 | 49 | |
| 3 | 2007 | 45 | |
| 4 | 2004 | 43 | |
| 5 | 2008 | 32 | |
| 6 | 2004 | 19 | |
| 7 | 2004 | 18 | |
| 8 | 2005 | 17 | |
| 9 | 2006 | 15 | |
| 10 | 2007 | 13 | |
| 11 | 1979 | 10 | |
| 12 | 2003 | 10 | |
| 13 | 2009 | 10 | |
| 14 | 2006 | 9 | |
| 15 | 2005 | 8 | |
| 16 | 2008 | 8 | |
| 17 | 2007 | 8 | |
| 18 | 2005 | 6 | |
| 19 | 2004 | 6 | |
| 20 | 2006 | 6 |
About Scott Irving
Scott Irving is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Electronic, Optical and Magnetic Materials and Biomedical Engineering, having authored 52 papers that have together received 479 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (45 papers), 3D IC and TSV technologies (19 papers), Copper Interconnects and Reliability (9 papers), Silicon Carbide Semiconductor Technologies (6 papers), Integrated Circuits and Semiconductor Failure Analysis (6 papers), Mechanical Behavior of Composites (5 papers), Electromagnetic Compatibility and Noise Suppression (5 papers) and Heat Transfer and Optimization (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (423 citations), Mechanics of Materials (120 citations), Electronic, Optical and Magnetic Materials (80 citations), Mechanical Engineering (133 citations) and Industrial and Manufacturing Engineering (21 citations). Scott Irving has collaborated with scholars based in United States, China and Australia. Frequent co-authors include Timwah Luk, Yong Liu, Lihua Liang, Yong Liu, Yong Liu, Yong Liu, Dan Kinzer, Yong Liu, Lihua Liang and Yuanxiang Zhang. Their work appears in journals such as IEEE Transactions on Electronics Packaging Manufacturing, Microelectronics Reliability, International Journal of Heat and Fluid Flow and Engineering Failure Analysis.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.