Thomas Plach
Impact in
-
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Photonic and Optical Devices
-
- Additive Manufacturing and 3D Printing Technologies
Papers in
-
- 3D IC and TSV technologies 17
- Electronic Packaging and Soldering Technologies 15
-
- Copper Interconnects and Reliability 4
- Co-authors
- Viorel Drăgoi (12 shared papers)Kurt Hingerl (5 shared papers)Markus Wimplinger (12 shared papers)Günter Hesser (2 shared papers)Sajjad Tollabimazraehno (2 shared papers)Bernhard Rebhan (3 shared papers)Reghu Menon (1 shared paper)Cigdem Yumusak (1 shared paper)
- Journals
- Journal of Applied Physics (2 papers)The Journal of Physical Chemistry C (1 paper)Physical Review B (1 paper)ECS Transactions (5 papers)Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena (1 paper)
- Partner nations
- AustriaFranceNetherlands
In The Last Decade
Thomas Plach
22 papers receiving 310 citations
Peers
Comparison fields: 5 of 31
- Electrical and Electronic Engineering 283
- Automotive Engineering 48
- Electronic, Optical and Magnetic Materials 42
- Ceramics and Composites 13
- Biomedical Engineering 70
Countries citing papers authored by Thomas Plach
This map shows the geographic impact of Thomas Plach's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Thomas Plach with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Thomas Plach more than expected).
Fields of papers citing papers by Thomas Plach
This network shows the impact of papers produced by Thomas Plach. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Thomas Plach. The network helps show where Thomas Plach may publish in the future.
Co-authors
The 25 scholars most cited alongside Thomas Plach, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 24 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2013 | 159 | |
| 2 | 2013 | 22 | |
| 3 | 2011 | 21 | |
| 4 | 2023 | 20 | |
| 5 | 2014 | 14 | |
| 6 | 2024 | 13 | |
| 7 | 2016 | 12 | |
| 8 | 2008 | 10 | |
| 9 | 2013 | 9 | |
| 10 | 2023 | 7 | |
| 11 | 2024 | 6 | |
| 12 | 2024 | 6 | |
| 13 | 2012 | 6 | |
| 14 | 2024 | 5 | |
| 15 | 2018 | 5 | |
| 16 | 2023 | 4 | |
| 17 | 2015 | 3 | |
| 18 | 2012 | 2 | |
| 19 | 2011 | 2 | |
| 20 | 2025 | 1 |
About Thomas Plach
Thomas Plach is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering, Automotive Engineering and Mechanics of Materials, having authored 24 papers that have together received 329 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (17 papers), Electronic Packaging and Soldering Technologies (15 papers), Advanced Surface Polishing Techniques (5 papers), Copper Interconnects and Reliability (4 papers), Adhesion, Friction, and Surface Interactions (2 papers), Additive Manufacturing and 3D Printing Technologies (2 papers), Silicon Nanostructures and Photoluminescence (2 papers) and Nanowire Synthesis and Applications (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (283 citations), Automotive Engineering (48 citations), Electronic, Optical and Magnetic Materials (42 citations), Ceramics and Composites (13 citations) and Biomedical Engineering (70 citations). Thomas Plach has collaborated with scholars based in Austria, France and Netherlands. Frequent co-authors include Viorel Drăgoi, Kurt Hingerl, Markus Wimplinger, Günter Hesser, Sajjad Tollabimazraehno, Bernhard Rebhan, Reghu Menon, Cigdem Yumusak, Motoharu Kawano and R. Koch. Their work appears in journals such as Journal of Applied Physics, The Journal of Physical Chemistry C, Physical Review B, ECS Transactions and Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.